Thermosetting resin composite and metal clad laminate using the same

Abstract

The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.

The invention claimed is: 
     
       1. A thermosetting resin composite for a metal clad laminate, the thermosetting resin composite comprising a thermosetting resin composition impregnated in a fabric substrate,
 wherein the thermosetting resin composition comprises:
 an amine compound comprising an aromatic diamine which includes a sulfone group or a trifluoromethyl group; 
 a thermosetting resin comprising an epoxy resin and a bismaleimide resin; 
 a thermoplastic resin comprising a (meth)acrylate-based polymer; and 
 an inorganic filler, 
 wherein the epoxy resin comprises one or more selected from the group consisting of a naphthalene-based epoxy resin, a biphenyl-based epoxy resin, and a dicyclopentadiene epoxy resin, 
 wherein the bismaleimide resin comprises a diphenylmethane bismaleimide phenylmethane maleimide resin, 
 wherein the (meth)acrylate-based polymer has a weight average molecular weight of 500,000 to 1,000,000, 
 wherein the inorganic filler comprises two or more kinds of inorganic fillers having different average particle diameters, and at least one of the two or more kinds of inorganic fillers is a silica having an average particle diameter of 0.1 μm to 100 μm and surface treated with a silane coupling agent, and at least one other is a silica having an average particle diameter of 1 nm to 90 nm and surface treated with a silane coupling agent, 
 
 wherein the thermosetting resin composition comprises the thermosetting resin in an amount of 285 parts by weight or less based on 100 parts by weight of the amine compound, the thermoplastic resin in an amount of 58 to 101 parts by weight based on 100 parts by weight of the thermosetting resin, and the inorganic filler in an amount of 70 to 150 parts by weight based on 100 parts by weight of the total amount of the thermosetting resin, the thermoplastic resin and the amine compound, and 
 wherein the thermosetting resin composite has a thermal stress factor of 20.4 MPa or less calculated by the following General Formula 1,
   Thermal Stress Factor=∫[(Storage Modulus)×CTE]dT  [General Formula 1]
 
 
 in General Formula 1, 
 the thermal stress factor is calculated from the storage modulus and the CTE (coefficient of thermal expansion) measured at a temperature range of 30° C. to 260° C., respectively, and 
 wherein the thermosetting resin composition has an equivalent ratio of 1.51 or more calculated by the following Equation 1,
   Equivalent ratio=total active hydrogen equivalent contained in the amine compound/total curable functional group equivalent contained in the thermosetting resin  [Equation 1].
 
 
 
     
     
       2. The thermosetting resin composite for a metal clad laminate of  claim 1 ,
 wherein the thermosetting resin composite has the thermal stress factor in the range of 10 to 25 MPa. 
 
     
     
       3. The thermosetting resin composite for a metal clad laminate of  claim 1 ,
 wherein the thermosetting resin composition has a glass transition temperature of 230° C. or less. 
 
     
     
       4. The thermosetting resin composite for a metal clad laminate of  claim 1 ,
 wherein the thermosetting resin composite has the storage modulus of 16 GPa or less at 30° C. and 180° C., respectively. 
 
     
     
       5. The thermosetting resin composite for a metal clad laminate of  claim 4 ,
 wherein the thermosetting resin composite has the storage modulus of 8 GPa or less at 260° C. 
 
     
     
       6. The thermosetting resin composite for a metal clad laminate of  claim 1 ,
 wherein the thermosetting resin composite has the CTE of 5 to 12 ppm/° C. 
 
     
     
       7. A metal clad laminate, comprising the thermosetting resin composite of  claim 1 ; and a metal foil formed on at least one surface of the thermosetting resin composite.