Inventor · disambiguated record
Hyunsung Min
Also filed as: MIN HYUNSUNG
7 granted patents·1 citations·filing 2018–2020
69Inventor score
Files withLG CHEMICAL LTD7
Top patents by PatentIndex Score
7 records- 0171US11597837B2Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2020·Granted Mar 7, 2023·1 cites·13 claims
- 0259US12037491B2Resin composition, prepreg including the same, laminated plate including the same, resin-coated metal foil including the sameLG CHEMICAL LTD·Filed 2019·Granted Jul 16, 2024·0 cites·15 claims
- 0351US11274218B2Thermosetting resin composition for coating metal thin film and metal laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Mar 15, 2022·0 cites·11 claims
- 0450US12129338B2Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2019·Granted Oct 29, 2024·0 cites·10 claims
- 0550US12091510B2Thermosetting resin composite and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2019·Granted Sep 17, 2024·0 cites·7 claims
- 0645US11459449B2Thermosetting resin composition for coating metal thin film and metal laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Oct 4, 2022·0 cites·15 claims
- 0745US11193015B2Thermosetting resin composition for semiconductor package and prepreg using the sameLG CHEMICAL LTD·Filed 2019·Granted Dec 7, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →