Inventor · disambiguated record
Heiko Stahl
Also filed as: STAHL HEIKO
21 granted patents·4 pending applications·26 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
25 records- 0174US9428378B2Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a componentBOSCH GMBH ROBERT·Filed 2015·Granted Aug 30, 2016·3 cites·9 claims
- 0270US9667419B2System and method for cryptographic key identificationBOSCH GMBH ROBERT·Filed 2015·Granted May 30, 2017·2 cites·8 claims
- 0368US9725300B2Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodesBOSCH GMBH ROBERT·Filed 2016·Granted Aug 8, 2017·1 cites·18 claims
- 0467US10336610B2Method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2017·Granted Jul 2, 2019·1 cites·4 claims
- 0563US8492188B2Method for producing a micromechanical componentSTAHL HEIKO·Filed 2011·Granted Jul 23, 2013·1 cites·9 claims
- 0663US8393215B2Micromechanical acceleration sensor having an open seismic massSTAHL HEIKO·Filed 2009·Granted Mar 12, 2013·4 cites·11 claims
- 0761US8402827B2Sensor element and method for operating a sensor elementSTAHL HEIKO·Filed 2010·Granted Mar 26, 2013·1 cites·13 claims
- 0861US2025199414A1Microelectromechanical deviceBOSCH GMBH ROBERT·Filed 2025·Application pending·0 cites
- 0960US7863072B2Micromechanical diaphragm sensor having a double diaphragmBOSCH GMBH ROBERT·Filed 2005·Granted Jan 4, 2011·1 cites·16 claims
- 1060US7740459B2Micropump having a pump diaphragm and a polysilicon layerBOSCH GMBH ROBERT·Filed 2004·Granted Jun 22, 2010·6 cites·3 claims
- 1156US8174082B2Micromechanical component having multiple caverns, and manufacturing methodFISCHER FRANK·Filed 2005·Granted May 8, 2012·2 cites·21 claims
- 1253US2017283253A1Micromechanical component having integrated passive electronic components and method for its productionBOSCH GMBH ROBERT·Filed 2017·Application pending·0 cites
- 1352US12404170B2Method for producing a bonding pad for a micromechanical sensor elementBOSCH GMBH ROBERT·Filed 2023·Granted Sep 2, 2025·0 cites·14 claims
- 1451US7436076B2Micromechanical component having an anodically bonded cap and a manufacturing methodBOSCH GMBH ROBERT·Filed 2006·Granted Oct 14, 2008·1 cites·2 claims
- 1550US2008164564A1Micromechanical component having integrated passive electronic components and method for its productionSTAHL HEIKO·Filed 2007·Application pending·0 cites
- 1649USD990958SBeverages machineCAFE TRES CORACOES S/A·Filed 2021·Granted Jul 4, 2023·1 cites·1 claims
- 1746US10775253B2Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical componentBOSCH GMBH ROBERT·Filed 2017·Granted Sep 15, 2020·0 cites·7 claims
- 1846US10643896B2Method for producing at least one via in a waferBOSCH GMBH ROBERT·Filed 2018·Granted May 5, 2020·0 cites·17 claims
- 1945US8563344B2Method for producing MEMS structures, and MEMS structureREINMUTH JOCHEN·Filed 2011·Granted Oct 22, 2013·0 cites·5 claims
- 2044US9206034B2Micromechanical component having a bond jointSTAHL HEIKO·Filed 2013·Granted Dec 8, 2015·0 cites·14 claims
- 2142US10889491B2Method for producing a micromechanical elementBOSCH GMBH ROBERT·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
- 2239USD954483SBeverage machineCAFE TRES CORACOES S A·Filed 2019·Granted Jun 14, 2022·2 cites·1 claims
- 2338US9650240B2Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this typeBOSCH GMBH ROBERT·Filed 2015·Granted May 16, 2017·0 cites·6 claims
- 2435US10766778B2Polycrystalline material having low mechanical strain; method for producing a polycrystalline materialBOSCH GMBH ROBERT·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 2531US2015232331A1Layer structure for a micromechanical componentBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →