Inventor · disambiguated record
Hiroshi Ashihara
Also filed as: ASHIHARA HIROSHI
56 granted patents·22 pending applications·524 citations·filing 2001–2025
98Inventor score
Files withHITACHI INT ELECTRIC INC43KOKUSAI ELECTRIC CORP19RENESAS TECH CORP6UNITIKA LTD4ABURATANI YUKINORI1
Top patents by PatentIndex Score
78 records- 0198US10297440B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 21, 2019·345 cites·7 claims
- 0291US9536734B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jan 3, 2017·7 cites·15 claims
- 0390US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 0490US8986450B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Mar 24, 2015·8 cites·15 claims
- 0589US6838772B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jan 4, 2005·47 cites·21 claims
- 0689US2025105001A1Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0789US2025105000A1Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0887US12198929B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 14, 2025·0 cites·15 claims
- 0987US9187826B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·6 cites·19 claims
- 1086US9816183B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 14, 2017·5 cites·18 claims
- 1186US9558937B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jan 31, 2017·4 cites·20 claims
- 1286US9190299B2Apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·7 cites·14 claims
- 1386US8925562B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 6, 2015·6 cites·13 claims
- 1486US2025349584A1Substrate transport system, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1585US9816182B2Substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 14, 2017·6 cites·10 claims
- 1685US9728409B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 8, 2017·4 cites·10 claims
- 1784US12387962B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1883US9916976B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 13, 2018·4 cites·12 claims
- 1983US9728400B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 8, 2017·3 cites·15 claims
- 2082US9698050B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 4, 2017·3 cites·20 claims
- 2180US11562905B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 24, 2023·1 cites·16 claims
- 2280US9587313B2Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 7, 2017·3 cites·14 claims
- 2380US7981761B2Method of manufacturing semiconductor device having MIM capacitorHITACHI LTD·Filed 2010·Granted Jul 19, 2011·6 cites·5 claims
- 2479US9508546B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·3 cites·1 claims
- 2577US11996311B2Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted May 28, 2024·0 cites·17 claims
- 2676US11854799B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 2776US10388530B2Method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 20, 2019·1 cites·14 claims
- 2876US2025069891A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2973US11170996B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 9, 2021·0 cites·19 claims
- 3072US6696357B2Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating filmRENESAS TECH CORP·Filed 2002·Granted Feb 24, 2004·20 cites·16 claims
- 3170US6764945B2Method of manufacturing a multilayer metallization structure with non-directional sputtering methodRENESAS TECH CORP·Filed 2001·Granted Jul 20, 2004·13 cites·21 claims
- 3270US2025218764A1Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3369US9831082B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·1 cites·16 claims
- 3468US12479195B2Gas barrier laminate and method for manufacturing sameUNITIKA LTD·Filed 2023·Granted Nov 25, 2025·0 cites·12 claims
- 3568US10128128B2Method of manufacturing semiconductor device having air gap between wirings for low dielectric constantHITACHI INT ELECTRIC INC·Filed 2017·Granted Nov 13, 2018·1 cites·5 claims
- 3668US9659767B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted May 23, 2017·1 cites·14 claims
- 3768US9190281B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 17, 2015·1 cites·13 claims
- 3867US12176216B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Dec 24, 2024·0 cites·8 claims
- 3967US9673043B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 6, 2017·1 cites·13 claims
- 4067US9059089B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 16, 2015·1 cites·6 claims
- 4166US12283476B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 22, 2025·0 cites·22 claims
- 4260US7777346B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 17, 2010·1 cites·12 claims
- 4358US12486368B2Polyester film and method for producing sameUNITIKA LTD·Filed 2021·Granted Dec 2, 2025·0 cites·14 claims
- 4457US7088001B2Semiconductor integrated circuit device with a metallization structureHITACHI ULSI SYS CO LTD·Filed 2004·Granted Aug 8, 2006·5 cites·16 claims
- 4557US2019393057A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 4656US2018247819A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 4754US12503549B2Biaxially-stretched polyester resin film and manufacturing method for sameUNITIKA LTD·Filed 2021·Granted Dec 23, 2025·0 cites·5 claims
- 4854US2025309187A1Substrate processing method, method of manufacturing semiconductor device, processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4953US2015187567A1Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 5051US2018277405A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →