Inventor · disambiguated record
Hiroaki Ashizawa
Also filed as: ASHIZAWA HIROAKI
19 granted patents·16 pending applications·53 citations·filing 2001–2025
91Inventor score
Files withTOKYO ELECTRON LTD14TOTO LTD13HITACHI VIA MECHANICS LTD2IWASAWA JUNICHI2MITSUBISHI MATERIALS CORP2
Top patents by PatentIndex Score
35 records- 0190US7531767B2Method and apparatus for laser perforating printed circuit boardHITACHI VIA MECHANICS LTD·Filed 2006·Granted May 12, 2009·17 cites·18 claims
- 0289US10087109B2StructureTOTO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·9 claims
- 0389US10081576B2StructureTOTO LTD·Filed 2017·Granted Sep 25, 2018·3 cites·13 claims
- 0484US11802085B2Composite structure and semiconductor manufacturing apparatus including composite structureTOTO LTD·Filed 2021·Granted Oct 31, 2023·1 cites·14 claims
- 0577US7205501B2Laser machining method and laser machining apparatusHITACHI VIA MECHANICS LTD·Filed 2004·Granted Apr 17, 2007·19 cites·5 claims
- 0671US9331139B2Ruthenium film formation method and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted May 3, 2016·2 cites·12 claims
- 0770US9963784B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2014·Granted May 8, 2018·1 cites·8 claims
- 0870US7897268B2Composite structureTOTO LTD·Filed 2006·Granted Mar 1, 2011·2 cites·8 claims
- 0969US10618847B2StructureTOTO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·2 claims
- 1066US10759710B2Composite structure, semiconductor manufacturing apparatus and display manufacturing apparatus provided with composite structureTOTO LTD·Filed 2019·Granted Sep 1, 2020·1 cites·12 claims
- 1164US2025340981A1Film forming methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1261US2018354859A1StructureTOTO LTD·Filed 2018·Application pending·0 cites
- 1360US2024200193A1Method of performing cleaning and apparatus for performing substrate processingTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1458US12112924B2Composite structure and semiconductor manufacturing apparatus including composite structureTOTO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·14 claims
- 1558US11389907B2Laser machining apparatus and laser machining methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 19, 2022·0 cites·10 claims
- 1656US8021717B2Film formation method, cleaning method and film formation apparatusTOKYO ELECTRON LTD·Filed 2009·Granted Sep 20, 2011·0 cites·16 claims
- 1754US2020063258A1Film-forming method and film-forming apparatusTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1854US2025273440A1Composite structure and semiconductor manufacturing apparatus including composite structureTOTO LTD·Filed 2023·Application pending·0 cites
- 1952US12119219B2Film forming method, method for manufacturing semiconductor device, film forming device, and system for manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2020·Granted Oct 15, 2024·0 cites·6 claims
- 2052US8278594B2Method and apparatus for perforating printed circuit boardARAI KUNIO·Filed 2009·Granted Oct 2, 2012·0 cites·1 claims
- 2152US6407010B1Single-substrate-heat-processing apparatus and method for semiconductor processTOKYO ELECTRON LTD·Filed 2001·Granted Jun 18, 2002·4 cites·15 claims
- 2252US2025101597A1Composite structure and semiconductor manufacturing apparatus including composite structureTOTO LTD·Filed 2023·Application pending·0 cites
- 2352US2025270099A1Composite structure and semiconductor manufacturing apparatus including composite structureTOTO LTD·Filed 2023·Application pending·0 cites
- 2449US2025305147A1Metal-containing film and method for producing metal-containing filmTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2548US2024170264A1Composite structure and semiconductor manufacturing device provided with the composite structureTOTO LTD·Filed 2022·Application pending·0 cites
- 2648US2024166567A1Composite structure and semiconductor manufacturing device provided with the composite structureTOTO LTD·Filed 2022·Application pending·0 cites
- 2747US2009196989A1Sharp blade and its manufacturing methodMITSUBISHI MATERIALS CORP·Filed 2009·Application pending·0 cites
- 2844US11348794B2Semiconductor film forming method using hydrazine-based compound gasTOKYO ELECTRON LTD·Filed 2019·Granted May 31, 2022·0 cites·15 claims
- 2944US10340176B2Substrate mounting method and substrate mounting deviceTOKYO ELECTRON LTD·Filed 2017·Granted Jul 2, 2019·0 cites·8 claims
- 3044US2009239454A1Cmp conditioner and process for producing the sameMITSUBISHI MATERIALS CORP·Filed 2007·Application pending·0 cites
- 3142US2005136657A1Film-formation method for semiconductor processTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 3239US10864548B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Dec 15, 2020·0 cites·13 claims
- 3333US2013115367A1Method for forming ruthenium oxide filmTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 3432US2008274348A1Method for Producing Coating Film Using Aerosol, Fine Particles for Use Therein, and Coating Film and Composite MaterialIWASAWA JUNICHI·Filed 2005·Application pending·0 cites
- 3530US2008274347A1Method for Producing Film Using Aerosol, Particles Mixture Therefor, and Film and Composite MaterialIWASAWA JUNICHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →