Inventor · disambiguated record
Hin Hwa Goh
Also filed as: GOH HIN HWA
30 granted patents·6 pending applications·279 citations·filing 2005–2025
97Inventor score
Top patents by PatentIndex Score
36 records- 0195US7666709B1Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patternsSTATS CHIPPAC LTD·Filed 2008·Granted Feb 23, 2010·40 cites·22 claims
- 0294US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 0394US8304880B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Nov 6, 2012·22 cites·20 claims
- 0493US8659162B2Semiconductor device having an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2011·Granted Feb 25, 2014·19 cites·25 claims
- 0593US8624364B2Integrated circuit packaging system with encapsulation connector and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Jan 7, 2014·17 cites·20 claims
- 0693US8067308B2Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2009·Granted Nov 29, 2011·28 cites·27 claims
- 0793US7250685B2Etched leadframe flipchip package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 31, 2007·25 cites·20 claims
- 0892US8648470B2Semiconductor device and method of forming FO-WLCSP with multiple encapsulantsLIN YAOJIAN·Filed 2011·Granted Feb 11, 2014·12 cites·24 claims
- 0991US9449943B2Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper patternSTATS CHIPPAC LTD·Filed 2014·Granted Sep 20, 2016·10 cites·23 claims
- 1089US8405230B2Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereofLEE JAE SOO·Filed 2011·Granted Mar 26, 2013·11 cites·21 claims
- 1189US7880313B2Semiconductor flip chip package having substantially non-collapsible spacerCHIPPAC INC·Filed 2005·Granted Feb 1, 2011·17 cites·6 claims
- 1287US7414318B2Etched leadframe flipchip package systemSTATS CHIPPAC LTD·Filed 2007·Granted Aug 19, 2008·13 cites·20 claims
- 1386US10163747B2Semiconductor device and method of controlling warpage in reconstituted waferSTATS CHIPPAC PTE LTD·Filed 2017·Granted Dec 25, 2018·4 cites·13 claims
- 1484US9607965B2Semiconductor device and method of controlling warpage in reconstituted waferSTATS CHIPPAC LTD·Filed 2013·Granted Mar 28, 2017·6 cites·33 claims
- 1584US8421212B2Integrated circuit packaging system with active surface heat removal and method of manufacture thereofCHEN KANG·Filed 2010·Granted Apr 16, 2013·8 cites·18 claims
- 1682US9666500B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2015·Granted May 30, 2017·2 cites·22 claims
- 1782US9054083B2Semiconductor device and method of making TSV interconnect structures using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2013·Granted Jun 9, 2015·4 cites·25 claims
- 1882US8455991B2Integrated circuit packaging system with warpage control and method of manufacture thereofHSIAO YUNG KUAN·Filed 2010·Granted Jun 4, 2013·10 cites·14 claims
- 1978US2025336788A1Semiconductor Device and Method of Forming Hybrid Substrate with Uniform ThicknessSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2077US8759155B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2013·Granted Jun 24, 2014·2 cites·24 claims
- 2174US12381141B2Semiconductor device and method of forming hybrid substrate with uniform thicknessSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 5, 2025·0 cites·25 claims
- 2274US8309451B2Semiconductor device and method of providing common voltage bus and wire bondable redistributionDO BYUNG TAI·Filed 2008·Granted Nov 13, 2012·5 cites·21 claims
- 2373US10790158B2Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper patternSTATS CHIPPAC PTE LTD·Filed 2018·Granted Sep 29, 2020·1 cites·25 claims
- 2473US8916416B2Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surfaceOMANDAM GLENN·Filed 2010·Granted Dec 23, 2014·5 cites·34 claims
- 2572US12469791B2Semiconductor device and method of stacking hybrid substrates with embedded electric componentsSTATS CHIPPAC PTE LTD·Filed 2022·Granted Nov 11, 2025·0 cites·21 claims
- 2671US9142428B2Semiconductor device and method of forming FO-WLCSP with multiple encapsulantsSTATS CHIPPAC LTD·Filed 2013·Granted Sep 22, 2015·2 cites·24 claims
- 2766US8766426B2Integrated circuit packaging system with warpage control and method of manufacture thereofGOH HIN HWA·Filed 2010·Granted Jul 1, 2014·3 cites·18 claims
- 2860US9087930B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2014·Granted Jul 21, 2015·0 cites·25 claims
- 2958US2025140730A1Semiconductor Device and Method of Forming Fan-Out Package Structure with Embedded Overhanging Backside AntennaSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 3057US2024379479A1Semiconductor Device and Method of Making a Fan-Out Semiconductor Package with Pre-Assembled Passive ModulesSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 3156US2025259947A1Semiconductor Device and Method of Forming AIP Package Structure from Separate Assemblies with Bonding MaterialSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 3255US2024096807A1Semiconductor Device and Method of Stacking Hybrid SubstratesSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 3354US10177010B2Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper patternSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jan 8, 2019·0 cites·17 claims
- 3452US10297556B2Semiconductor device and method of controlling warpage in reconstituted waferSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 21, 2019·0 cites·26 claims
- 3548US2012261817A1Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable RedistributionDO BYUNG TAI·Filed 2012·Application pending·0 cites
- 3643US9236278B2Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereofHUANG RUI·Filed 2011·Granted Jan 12, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →