Inventor · disambiguated record
Hisataka Hayashi
Also filed as: HAYASHI HISATAKA · INAZAWA LEGAL REPRESENTATIVE R
35 granted patents·12 pending applications·1,114 citations·filing 1992–2022
98Inventor score
Top patents by PatentIndex Score
47 records- 0197US10388544B2Substrate processing apparatus and substrate processing methodTOSHIBA KK·Filed 2015·Granted Aug 20, 2019·45 cites·4 claims
- 0295US8821684B2Substrate plasma processing apparatus and plasma processing methodUI AKIO·Filed 2009·Granted Sep 2, 2014·52 cites·5 claims
- 0395US5302240AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1993·Granted Apr 12, 1994·200 cites·22 claims
- 0493US5595627APlasma etching methodTOKYO ELECTRON LTD·Filed 1996·Granted Jan 21, 1997·171 cites·18 claims
- 0593US5592024ASemiconductor device having a wiring layer with a barrier layerTOSHIBA KK·Filed 1994·Granted Jan 7, 1997·133 cites·5 claims
- 0691US6794286B2Process for fabricating a metal wiring and metal contact in a semicondutor deviceTOSHIBA KK·Filed 2000·Granted Sep 21, 2004·55 cites·11 claims
- 0788US10332906B2Dry etching method and method for manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Jun 25, 2019·6 cites·13 claims
- 0888US7625494B2Plasma etching method and plasma etching unitTOKYO ELECTRON LTD·Filed 2004·Granted Dec 1, 2009·35 cites·14 claims
- 0987US7749914B2Plasma etching methodTOKYO ELECTRON LTD·Filed 2004·Granted Jul 6, 2010·39 cites·6 claims
- 1087US5445710AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1994·Granted Aug 29, 1995·86 cites·18 claims
- 1186US6576562B2Manufacturing method of semiconductor device using mask pattern having high etching resistanceTOSHIBA KK·Filed 2001·Granted Jun 10, 2003·36 cites·23 claims
- 1283US6780278B2Plasma processing apparatus with reduced parasitic capacity and loss in RF powerTOSHIBA KK·Filed 2001·Granted Aug 24, 2004·16 cites·16 claims
- 1377US8821744B2Substrate processing method and substrate processing apparatusUI AKIO·Filed 2011·Granted Sep 2, 2014·4 cites·9 claims
- 1476US9111875B2Pattern formation methodTOSHIBA KK·Filed 2014·Granted Aug 18, 2015·3 cites·13 claims
- 1576US5240554AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1992·Granted Aug 31, 1993·59 cites·23 claims
- 1674US6090699AMethod of making a semiconductor deviceTOSHIBA KK·Filed 1996·Granted Jul 18, 2000·35 cites·6 claims
- 1774US5310454ADry etching methodTOSHIBA KK·Filed 1993·Granted May 10, 1994·54 cites·9 claims
- 1873US8545670B2Plasma processing apparatus and plasma processing methodKOJIMA AKIHIRO·Filed 2008·Granted Oct 1, 2013·4 cites·5 claims
- 1971US12087556B2Plasma processing apparatus and plasma processing methodKIOXIA CORP·Filed 2021·Granted Sep 10, 2024·0 cites·8 claims
- 2070US5503901ASurface treatment method and surface treatment apparatusTOSHIBA KK·Filed 1994·Granted Apr 2, 1996·45 cites·26 claims
- 2168US7658859B2Method of processing organic film using plasma etching and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Feb 9, 2010·2 cites·17 claims
- 2268US2023114349A1Etching method, semiconductor manufacturing apparatus, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 2367US7727899B2Manufacturing method of semiconductor device and semiconductor storage device including fine contact holesTOSHIBA KK·Filed 2007·Granted Jun 1, 2010·2 cites·20 claims
- 2465US10381198B2Plasma processing apparatus and plasma processing methodTOSHIBA MEMORY CORP·Filed 2013·Granted Aug 13, 2019·1 cites·13 claims
- 2564US6274512B1Method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Aug 14, 2001·11 cites·3 claims
- 2662US6420271B2Method of forming a patternTOSHIBA KK·Filed 2001·Granted Jul 16, 2002·8 cites·20 claims
- 2761US9583360B2Substrate processing apparatus and substrate processing methodUI AKIO·Filed 2012·Granted Feb 28, 2017·1 cites·8 claims
- 2861US8252193B2Plasma processing apparatus of substrate and plasma processing method thereofUI AKIO·Filed 2008·Granted Aug 28, 2012·1 cites·9 claims
- 2960US11651969B2Etching method, semiconductor manufacturing apparatus, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted May 16, 2023·0 cites·14 claims
- 3057US8084360B2Method of manufacturing semiconductor deviceKASAHARA YUSUKE·Filed 2010·Granted Dec 27, 2011·1 cites·20 claims
- 3157US7419613B2Method and device for plasma-etching organic material filmTOKYO ELECTRON LTD·Filed 2003·Granted Sep 2, 2008·5 cites·11 claims
- 3256US8840753B2Plasma etching unitHONDA MASANOBU·Filed 2009·Granted Sep 23, 2014·0 cites·20 claims
- 3354US2010072172A1Substrate processing apparatus and substrate processing methodUI AKIO·Filed 2009·Application pending·0 cites
- 3454US2017186589A1Plasma processing apparatus and plasma processing methdoTOSHIBA KK·Filed 2017·Application pending·0 cites
- 3550US7285498B2Etching methodTOSHIBA KK·Filed 2004·Granted Oct 23, 2007·2 cites·19 claims
- 3650US2017169996A1Plasma processing apparatus and plasma processing methdoTOSHIBA KK·Filed 2017·Application pending·0 cites
- 3750US2016027619A1Plasma processing apparatus and plasma processing methodTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3845US2004238126A1Plasma processing apparatus with reduced parasitic capacity and loss in RF powerTOSHIBA KK·Filed 2004·Application pending·0 cites
- 3940US2005039854A1Plasma etching method and plasma etching unitFiled 2004·Application pending·0 cites
- 4039US2013344698A1Pattern formation methodTOSHIBA KK·Filed 2013·Application pending·0 cites
- 4138US2003181031A1Method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2002·Application pending·0 cites
- 4237US2005009356A1Method of manufacturing semiconductor device and method of cleaning plasma etching apparatus used thereforFiled 2004·Application pending·0 cites
- 4335US8524609B2Method of fabricating semiconductor deviceINADA SATOSHI·Filed 2011·Granted Sep 3, 2013·0 cites·16 claims
- 4435US2005103441A1Etching method and plasma etching apparatusFiled 2004·Application pending·0 cites
- 4533US8536061B2Semiconductor device manufacturing methodHAYASHI HISATAKA·Filed 2011·Granted Sep 17, 2013·0 cites·14 claims
- 4631US5302665AStyrene or vinyl chloride resin with glycidyl(oxy)/amido-modified polyolefinKANEGAFUCHI KAGAKU KABUSHIKI K·Filed 1992·Granted Apr 12, 1994·2 cites·8 claims
- 4729US2011223750A1Method for manufacturing semiconductor device and semiconductor manufacturing apparatusHAYASHI HISATAKA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →