Inventor · disambiguated record
Hideto Kato
Also filed as: KATO HIDETO
101 granted patents·7 pending applications·928 citations·filing 1986–2022
99Inventor score
Top patents by PatentIndex Score
108 records- 0197US8715905B2Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the methodSHINETSU CHEMICAL CO·Filed 2013·Granted May 6, 2014·24 cites·6 claims
- 0296US7785766B2Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective filmSHINETSU CHEMICAL CO·Filed 2008·Granted Aug 31, 2010·36 cites·4 claims
- 0393US10128143B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Nov 13, 2018·9 cites·15 claims
- 0491US10982053B2Polymer containing silphenylene and polyether structuresSHINETSU CHEMICAL CO·Filed 2019·Granted Apr 20, 2021·6 cites·5 claims
- 0589US9012111B2Photo-curable resin composition, photo-curable dry film, patterning process, protective film, and electric/electronic partSHINETSU CHEMICAL CO·Filed 2013·Granted Apr 21, 2015·6 cites·15 claims
- 0689US8729148B2Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic partsASAI SATOSHI·Filed 2010·Granted May 20, 2014·12 cites·17 claims
- 0789US7638259B2Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the compositionSHINETSU CHEMICAL CO·Filed 2007·Granted Dec 29, 2009·8 cites·11 claims
- 0888US7214743B2Resist lower layer film material and method for forming a patternSHINETSU CHEMICAL CO·Filed 2004·Granted May 8, 2007·29 cites·10 claims
- 0987US8999817B2Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Apr 7, 2015·7 cites·44 claims
- 1087US6590010B2Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coatingSHIN ETSU CHEMICALS CO LTD·Filed 2001·Granted Jul 8, 2003·38 cites·4 claims
- 1186US8785114B2Method for manufacturing micro-structureKATO HIDETO·Filed 2011·Granted Jul 22, 2014·4 cites·8 claims
- 1286US7485405B2Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting filmSHINETSU CHEMICAL CO·Filed 2005·Granted Feb 3, 2009·25 cites·11 claims
- 1386US4652663ANovel organosilicon compoundSHINETSU CHEMICAL CO·Filed 1986·Granted Mar 24, 1987·22 cites·11 claims
- 1485US7476485B2Resist lower layer film material and method for forming a patternSHIN ESTU CHEMICAL CO LTD·Filed 2004·Granted Jan 13, 2009·25 cites·10 claims
- 1584US6440646B2Positive resist composition suitable for lift-off technique and pattern forming methodSHINETSU CHEMICAL CO·Filed 2001·Granted Aug 27, 2002·21 cites·20 claims
- 1683US8673537B2Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said compositionFURUYA MASAHIRO·Filed 2010·Granted Mar 18, 2014·4 cites·18 claims
- 1783US8263308B2Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formationTAGAMI SHOHEI·Filed 2010·Granted Sep 11, 2012·6 cites·10 claims
- 1881US10658314B2Wafer laminate, method for production thereof, and adhesive composition for wafer laminateSHINETSU CHEMICAL CO·Filed 2017·Granted May 19, 2020·1 cites·9 claims
- 1981US8697333B2Photocurable resin composition, dry film thereof, pattern forming method, and electrical/electronic part protective filmSOGA KYOKO·Filed 2011·Granted Apr 15, 2014·5 cites·15 claims
- 2081US8378148B2Alcoholic hydroxyl-containing compounds and making methodSHINETSU CHEMICAL CO·Filed 2010·Granted Feb 19, 2013·2 cites·2 claims
- 2181US6538093B2Polyimide silicone resin, process for its production, and polyimide silicone resin compositionSHINETSU CHEMICAL CO·Filed 2001·Granted Mar 25, 2003·15 cites·14 claims
- 2280US9447305B2Silicone resin, resin composition, resin film, semiconductor device, and making methodSHINETSU CHEMICAL CO·Filed 2015·Granted Sep 20, 2016·3 cites·11 claims
- 2380US9263333B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 16, 2016·4 cites·21 claims
- 2480US8481244B2Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective filmTAKEDA TAKANOBU·Filed 2010·Granted Jul 9, 2013·5 cites·9 claims
- 2579US10115622B2Wafer processing laminate and method for processing waferSHINETSU CHEMICAL CO·Filed 2016·Granted Oct 30, 2018·2 cites·14 claims
- 2679US7781541B2Polyimide silicone resin and thermosetting composition comprising the sameSHINETSU CHEMICAL CO·Filed 2007·Granted Aug 24, 2010·3 cites·12 claims
- 2779US6635400B2Resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2001·Granted Oct 21, 2003·17 cites·23 claims
- 2878US6210855B1Positive resist composition suitable for lift-off technique and pattern forming methodSHINETSU CHEMICAL CO·Filed 1999·Granted Apr 3, 2001·35 cites·3 claims
- 2977US10297485B2Semiconductor device, making method, and laminateSHINETSU CHEMICAL CO·Filed 2018·Granted May 21, 2019·2 cites·5 claims
- 3077US8466041B2Method for manufacturing lamination type semiconductor integrated deviceKURODA YASUYOSHI·Filed 2010·Granted Jun 18, 2013·6 cites·25 claims
- 3177US7378215B2Positive photoresist compositionSHINETSU CHEMICAL CO·Filed 2006·Granted May 27, 2008·4 cites·10 claims
- 3277US4742177AMethacrylic acid esterSHINETSU CHEMICAL CO·Filed 1987·Granted May 3, 1988·21 cites·3 claims
- 3376US10416559B2Film material and pattern forming processSHINETSU CHEMICAL CO·Filed 2017·Granted Sep 17, 2019·1 cites·7 claims
- 3476US10319653B2Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 11, 2019·3 cites·10 claims
- 3576US9653335B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodKATO HIDETO·Filed 2012·Granted May 16, 2017·4 cites·7 claims
- 3676US8501879B2Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatusKONDO KAZUNORI·Filed 2011·Granted Aug 6, 2013·5 cites·16 claims
- 3775US7060761B2Epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 2003·Granted Jun 13, 2006·12 cites·9 claims
- 3874US7678874B2Polyimide having an alcoholic hydroxyl group and a process for the preparation thereofSHINETSU CHEMICAL CO·Filed 2005·Granted Mar 16, 2010·2 cites·6 claims
- 3974US6911292B2Positive resist composition and patterning processSHINETSU CHEMICAL CO·Filed 2003·Granted Jun 28, 2005·12 cites·4 claims
- 4073US6867325B2Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate-protecting coatSHINETSU CHEMICAL CO·Filed 2002·Granted Mar 15, 2005·10 cites·4 claims
- 4172US7041766B2Colorless and transparent polyimidesilicone resin having thermosetting functional groupsSHINETSU CHEMICAL CO·Filed 2003·Granted May 9, 2006·19 cites·7 claims
- 4272US6001534APhotosensitive resin compositionSHINETSU CHEMICAL CO·Filed 1998·Granted Dec 14, 1999·24 cites·5 claims
- 4371US9096032B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 4, 2015·2 cites·23 claims
- 4471US6218069B1Photosensitive resin composition and making processSHINETSU CHEMICAL CO·Filed 2000·Granted Apr 17, 2001·11 cites·3 claims
- 4570US8785585B2Temporary adhesive composition, and method of producing thin waferFURUYA MASAHIRO·Filed 2012·Granted Jul 22, 2014·2 cites·9 claims
- 4670US5346979ACurable resin, process for making and electronic part protective coatingSHINETSU CHEMICAL CO·Filed 1993·Granted Sep 13, 1994·15 cites·4 claims
- 4769US5441845APhotosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinoneSHINETSU CHEMICAL CO·Filed 1994·Granted Aug 15, 1995·21 cites·9 claims
- 4867US10373903B2Laminate and making methodSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 6, 2019·0 cites·6 claims
- 4967US6437058B2Polymers and positive resist compositionsSHINETSU CHEMICAL CO·Filed 2001·Granted Aug 20, 2002·7 cites·15 claims
- 5067US5590855ATrain detection device for railroad models and train crossing control apparatus utilizing the train detection deviceFiled 1994·Granted Jan 7, 1997·32 cites·4 claims
Showing the top 50 of 108 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →