Inventor · disambiguated record
Hisashi Kawafuji
Also filed as: KAWAFUJI HISASHI
38 granted patents·1,048 citations·filing 1996–2018
98Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP38
Top patents by PatentIndex Score
38 records- 0195USD783550SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 11, 2017·42 cites·1 claims
- 0293USD770994SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Nov 8, 2016·32 cites·1 claims
- 0393US6313520B1Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereonMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 6, 2001·83 cites·10 claims
- 0493USD448739SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 2, 2001·51 cites·1 claims
- 0593USD401912SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 1, 1998·54 cites·1 claims
- 0693USD394244SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 12, 1998·56 cites·1 claims
- 0792USD505399SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted May 24, 2005·45 cites·1 claims
- 0891US6603197B1Semiconductor unitMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Aug 5, 2003·60 cites·13 claims
- 0990USD505400SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2004·Granted May 24, 2005·47 cites·1 claims
- 1089USD421969SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 28, 2000·36 cites·1 claims
- 1187USD777124SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jan 24, 2017·20 cites·1 claims
- 1287USD470825SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Feb 25, 2003·34 cites·1 claims
- 1385US7808085B2Semiconductor device and mold for resin-molding semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Oct 5, 2010·13 cites·7 claims
- 1484USD418485SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 4, 2000·26 cites·1 claims
- 1583USD472530SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Apr 1, 2003·28 cites·1 claims
- 1682US7361983B2Semiconductor device and semiconductor assembly module with a gap-controlling lead structureMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 22, 2008·37 cites·19 claims
- 1779US5834842ASemiconductor device, semiconductor module, and radiating finMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 10, 1998·58 cites·15 claims
- 1878US9230891B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 5, 2016·4 cites·8 claims
- 1978USD470463SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Feb 18, 2003·22 cites·1 claims
- 2076USD772182SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Nov 22, 2016·13 cites·1 claims
- 2172USD428859SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Aug 1, 2000·16 cites·1 claims
- 2271US6794742B2Inverter module having a plurality of terminals at a predetermined pitchMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Sep 21, 2004·17 cites·17 claims
- 2371USD448740SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 2, 2001·17 cites·1 claims
- 2470US6791167B2Resin-molded device and manufacturing apparatus thereofMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 14, 2004·18 cites·14 claims
- 2569US6002166ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 14, 1999·39 cites·8 claims
- 2667US5672910ASemiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 30, 1997·36 cites·18 claims
- 2766US7166926B2Method for producing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jan 23, 2007·12 cites·4 claims
- 2865US6734551B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted May 11, 2004·14 cites·14 claims
- 2965USD470824SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Feb 25, 2003·13 cites·1 claims
- 3065US5998856ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 7, 1999·34 cites·6 claims
- 3165US5747876ASemiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 5, 1998·32 cites·20 claims
- 3263US5773883ASemiconductor device and semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 30, 1998·30 cites·10 claims
- 3357US7781262B2Method for producing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Aug 24, 2010·1 cites·20 claims
- 3457US7671453B2Semiconductor device and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Mar 2, 2010·8 cites·8 claims
- 3555US9716058B2Power module and control integrated circuitMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 25, 2017·0 cites·6 claims
- 3651US10332869B2Method for manufacturing power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 25, 2019·0 cites·7 claims
- 3747US9324685B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 26, 2016·0 cites·1 claims
- 3844US10796979B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 6, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →