Inventor · disambiguated record
Hiroshi Marumoto
Also filed as: MARUMOTO HIROSHI
15 granted patents·22 pending applications·30 citations·filing 2013–2025
89Inventor score
Technology areasH10P
Files withTOKYO ELECTRON LTD37
Top patents by PatentIndex Score
37 records- 0188US10576493B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Mar 3, 2020·6 cites·9 claims
- 0287US9953840B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2016·Granted Apr 24, 2018·5 cites·11 claims
- 0386US11738363B2Bath systems and methods thereofTOKYO ELECTRON LTD·Filed 2021·Granted Aug 29, 2023·1 cites·19 claims
- 0486US10504718B2Substrate processing apparatus, substrate processing method, and storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted Dec 10, 2019·5 cites·10 claims
- 0585US10395950B2Substrate processing apparatus, substrate processing method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 27, 2019·5 cites·10 claims
- 0680US12226796B2Bath systems and methods thereofTOKYO ELECTRON LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0780US10950465B2Method of cleaning substrate processing apparatus and system of cleaning substrate processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Mar 16, 2021·3 cites·7 claims
- 0879US2025196175A1Bath systems and methods thereofTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0976US10692739B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Jun 23, 2020·2 cites·8 claims
- 1072US9508574B2Process liquid supply apparatus operating method, process liquid supply apparatus and non-transitory storage mediumTOKYO ELECTRON LTD·Filed 2013·Granted Nov 29, 2016·2 cites·5 claims
- 1170US9576829B1Process liquid supply apparatus operating method, process liquid supply apparatus and non-transitory storage mediumTOKYO ELECTRON LTD·Filed 2016·Granted Feb 21, 2017·1 cites·6 claims
- 1264US12488452B2Wafer bath imagingTOKYO ELECTRON LTD·Filed 2021·Granted Dec 2, 2025·0 cites·18 claims
- 1361US2025025908A1Flow rate adjustment method in substrate processing apparatus and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1460US2024282603A1Substrate processing apparatus and method of estimating flow rate of processing liquid for substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1560US2024404845A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1659US2024282598A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1757US2025372456A1Substrate processing apparatus, calibration substrate, and calibration methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1857US2025391683A1Substrate treatment device and film thickness estimation methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1956US2025108393A1Liquid processing method, discharge adjustment method, and liquid processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2056US2023307270A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2156US2023307271A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2254US2025029852A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2354US2024096656A1Etching control system and etching control methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2454US2024096658A1Etching control device, etching control method, and etching control systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2554US2024096657A1Etching control system and etching control methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2654US2025308946A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2753US11862483B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 2, 2024·0 cites·17 claims
- 2849US10844332B2Aqueous cleaning solution and method of protecting features on a substrate during etch residue removalTOKYO ELECTRON LTD·Filed 2018·Granted Nov 24, 2020·0 cites·18 claims
- 2948US2024413022A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3047US2024192111A1Substrate liquid-treatment deviceTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3146US10847387B2Substrate processing apparatus, substrate processing method and recording mediumTOKYO ELECTRON LTD·Filed 2018·Granted Nov 24, 2020·0 cites·13 claims
- 3243US2024304452A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3342US10707098B2Substrate processing apparatus, substrate processing method and memory mediumTOKYO ELECTRON LTD·Filed 2017·Granted Jul 7, 2020·0 cites·20 claims
- 3442US2014137893A1Substrate processing apparatus, substrate processing method and storage mediumTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 3538US2020020550A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 3638US2018254180A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 3737US2018138058A1Substrate processing apparatus, substrate processing method, and storage mediumTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →