Inventor · disambiguated record
Hiroshi Morikazu
Also filed as: MORIKAZU HIROSHI
95 granted patents·34 pending applications·414 citations·filing 2004–2024
99Inventor score
Top patents by PatentIndex Score
129 records- 0197US7473866B2Laser processing apparatusDISCO CORP·Filed 2006·Granted Jan 6, 2009·124 cites·3 claims
- 0293US9193008B2Laser processing method and laser processing apparatusMORIKAZU HIROSHI·Filed 2012·Granted Nov 24, 2015·14 cites·7 claims
- 0392US9174305B2Laser processing apparatus including plasma detecting meansDISCO CORP·Filed 2012·Granted Nov 3, 2015·14 cites·2 claims
- 0492US8148184B2Optical device wafer processing methodKOYANAGI TASUKU·Filed 2011·Granted Apr 3, 2012·20 cites·6 claims
- 0590US9656347B2Laser processing method for forming a laser processed hole in a work pieceDISCO CORP·Filed 2016·Granted May 23, 2017·3 cites·3 claims
- 0690US9209591B2Laser processing methodDISCO CORP·Filed 2014·Granted Dec 8, 2015·10 cites·9 claims
- 0790US7601616B2Wafer laser processing methodDISCO CORP·Filed 2007·Granted Oct 13, 2009·15 cites·2 claims
- 0889US10319593B2Wafer thinning methodDISCO CORP·Filed 2016·Granted Jun 11, 2019·6 cites·4 claims
- 0989US9095931B2Laser processing method and laser processing apparatusDISCO CORP·Filed 2013·Granted Aug 4, 2015·7 cites·3 claims
- 1086US7557904B2Wafer holding mechanismDISCO CORP·Filed 2006·Granted Jul 7, 2009·12 cites·5 claims
- 1185US10910511B2Manufacturing method of III-V compound crystal and manufacturing method of semiconductor deviceDISCO CORP·Filed 2018·Granted Feb 2, 2021·2 cites·17 claims
- 1285US9517962B2Plate-shaped object processing methodDISCO CORP·Filed 2015·Granted Dec 13, 2016·3 cites·4 claims
- 1385US7675002B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Mar 9, 2010·8 cites·1 claims
- 1484US11211296B2Comparing method and laser processing apparatusDISCO CORP·Filed 2020·Granted Dec 28, 2021·2 cites·2 claims
- 1584US9576835B2Workpiece processing methodDISCO CORP·Filed 2014·Granted Feb 21, 2017·8 cites·8 claims
- 1684US7471384B2Via hole depth detectorDISCO CORP·Filed 2007·Granted Dec 30, 2008·15 cites·8 claims
- 1783US9543466B2Method for forming shield tunnels in single-crystal substratesDISCO CORP·Filed 2016·Granted Jan 10, 2017·3 cites·2 claims
- 1882US10119921B2Internal crack detecting method and internal crack detecting apparatusDISCO CORP·Filed 2017·Granted Nov 6, 2018·3 cites·15 claims
- 1982US9812362B2Wafer processing methodDISCO CORP·Filed 2017·Granted Nov 7, 2017·3 cites·4 claims
- 2082US9349646B2Wafer processing method including a filament forming step and an etching stepDISCO CORP·Filed 2014·Granted May 24, 2016·5 cites·8 claims
- 2182US7919395B2Method for separating wafer using two laser beamsDISCO CORP·Filed 2008·Granted Apr 5, 2011·8 cites·6 claims
- 2281US10071442B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Sep 11, 2018·3 cites·2 claims
- 2381US8518803B2Laser processing method for semiconductor waferMORIKAZU HIROSHI·Filed 2010·Granted Aug 27, 2013·5 cites·6 claims
- 2481US8314014B2Laser processing apparatus and laser processing methodMORIKAZU HIROSHI·Filed 2010·Granted Nov 20, 2012·5 cites·2 claims
- 2581US7754582B2Laser processing methodDISCO CORP·Filed 2009·Granted Jul 13, 2010·9 cites·5 claims
- 2680US9530929B2Lift-off methodDISCO CORP·Filed 2015·Granted Dec 27, 2016·2 cites·11 claims
- 2780US8779325B2Laser beam processing machineNOMARU KEIJI·Filed 2008·Granted Jul 15, 2014·6 cites·15 claims
- 2880US8049133B2Laser beam machining apparatusDISCO CORP·Filed 2008·Granted Nov 1, 2011·6 cites·8 claims
- 2980US7408129B2Laser beam machine with cylindrical lens systemDISCO CORP·Filed 2006·Granted Aug 5, 2008·8 cites·11 claims
- 3079US9536786B2Wafer processing method using pulsed laser beam to form shield tunnels along division lines of a semiconductor waferDISCO CORP·Filed 2015·Granted Jan 3, 2017·4 cites·2 claims
- 3179US9537046B2Optical device wafer processing methodDISCO CORP·Filed 2014·Granted Jan 3, 2017·4 cites·2 claims
- 3278US9613795B2Wafer processing method to remove crystal strainsDISCO CORP·Filed 2015·Granted Apr 4, 2017·3 cites·2 claims
- 3378US8258428B2Laser beam processing machineMORIKAZU HIROSHI·Filed 2007·Granted Sep 4, 2012·6 cites·3 claims
- 3478US7569840B2Alignment method of a laser beam processing machineDISCO CORP·Filed 2007·Granted Aug 4, 2009·10 cites·1 claims
- 3577US12151312B2Laser processing apparatusDISCO CORP·Filed 2023·Granted Nov 26, 2024·0 cites·1 claims
- 3677US9117895B2Laser processing methodDISCO CORP·Filed 2014·Granted Aug 25, 2015·3 cites·9 claims
- 3776US7355157B2Laser beam processing machine employing two beam spots having arcuate portions for forming a substantially rectangular combined spotDISCO CORP·Filed 2006·Granted Apr 8, 2008·5 cites·4 claims
- 3875US9233433B2Laser processing method and laser processing apparatusDISCO CORP·Filed 2013·Granted Jan 12, 2016·2 cites·3 claims
- 3974US8404999B2Laser processing apparatusTOGASHI KEN·Filed 2010·Granted Mar 26, 2013·4 cites·1 claims
- 4074US7732729B2Laser processing deviceDISCO CORP·Filed 2007·Granted Jun 8, 2010·4 cites·8 claims
- 4174US7629229B2Laser processing methodDISCO CORP·Filed 2009·Granted Dec 8, 2009·4 cites·3 claims
- 4272US10483149B2Wafer processing method for dividing a wafer, including a shield tunnel forming stepDISCO CORP·Filed 2018·Granted Nov 19, 2019·1 cites·6 claims
- 4372US9044819B2Laser processing apparatusDISCO CORP·Filed 2012·Granted Jun 2, 2015·2 cites·2 claims
- 4472US8610030B2Laser beam processing machineOBA RYUGO·Filed 2007·Granted Dec 17, 2013·5 cites·2 claims
- 4571US9305793B2Wafer processing methodDISCO CORP·Filed 2014·Granted Apr 5, 2016·2 cites·6 claims
- 4670US10727127B2Method of processing a substrateDISCO CORP·Filed 2018·Granted Jul 28, 2020·1 cites·17 claims
- 4770US9941166B2Method of processing a substrateDISCO CORP·Filed 2017·Granted Apr 10, 2018·1 cites·14 claims
- 4870US7589332B2Via-hole processing methodDISCO CORP·Filed 2007·Granted Sep 15, 2009·4 cites·2 claims
- 4969US12337412B2Laser processing apparatus and laser processing methodDISCO CORP·Filed 2023·Granted Jun 24, 2025·0 cites·6 claims
- 5069US8258045B2Device processing methodMORIKAZU HIROSHI·Filed 2010·Granted Sep 4, 2012·2 cites·3 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hiroshi Morikazu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →