Inventor · disambiguated record
Hidetaka Nambu
Also filed as: NAMBU HIDETAKA
8 granted patents·7 pending applications·36 citations·filing 1997–2015
80Inventor score
Files withNEC CORP3NEC ELECTRONICS CORP3RENESAS ELECTRONICS CORP3NAMBU HIDETAKA1RENESAS ELECTRONIC CORP1
Top patents by PatentIndex Score
15 records- 0157US7800108B2Semiconductor device and method of manufacturing semiconductor device including optical test pattern above a light shielding filmNEC ELECTRONICS CORP·Filed 2008·Granted Sep 21, 2010·1 cites·10 claims
- 0256US6136722APlasma etching method for forming hole in masked silicon dioxideNEC CORP·Filed 1998·Granted Oct 24, 2000·23 cites·20 claims
- 0353US9466503B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 11, 2016·0 cites·20 claims
- 0449US2008119054A1Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0547US8021899B2Method of manufacturing a semiconductor device including optical test pattern above a light shielding filmRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 20, 2011·0 cites·7 claims
- 0644US7704877B2Method of manufacturing semiconductor device and control systemNEC ELECTRONICS CORP·Filed 2008·Granted Apr 27, 2010·0 cites·12 claims
- 0744US2011318849A1Method of manufacturing a semiconductor deviceNAMBU HIDETAKA·Filed 2011·Application pending·0 cites
- 0843US5988104APlasma treatment systemNEC CORP·Filed 1997·Granted Nov 23, 1999·12 cites·16 claims
- 0937US7969584B2Measuring method including measuring angle of concave portion and irradiating light over concave portionRENESAS ELECTRONIC CORP·Filed 2008·Granted Jun 28, 2011·0 cites·5 claims
- 1036US8349087B2Semiconductor device manufacturing method, wafer treatment system, and recording mediumRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 8, 2013·0 cites·11 claims
- 1134US2016268294A1Semiconductor device and method for forming pattern in conductive layerTOSHIBA KK·Filed 2015·Application pending·0 cites
- 1233US2003186534A1Method for manufacturing semiconductor device using dual-damascene techniquesFiled 2003·Application pending·0 cites
- 1333US2002164881A1Method for manufacturing semiconductor deviceNEC CORP·Filed 2002·Application pending·0 cites
- 1431US2001034137A1Semiconductor device and manufacturing method of the deviceFiled 2001·Application pending·0 cites
- 1531US2003020176A1Semiconductor device and manufacturing method thereofFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →