Inventor · disambiguated record
Hisaharu Obinata
Also filed as: OBINATA HISAHARU
5 granted patents·191 citations·filing 1985–1997
84Inventor score
Top patents by PatentIndex Score
5 records- 0182US6280585B1Sputtering apparatus for filling pores of a circular substrateULVAC INC·Filed 1997·Granted Aug 28, 2001·71 cites·2 claims
- 0277US4624767ASputter etching apparatus having a second electrically floating electrode and magnet meansULVAC CORP·Filed 1985·Granted Nov 25, 1986·39 cites·3 claims
- 0373US6290826B1Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assemblyULVAC CORP·Filed 1997·Granted Sep 18, 2001·30 cites·20 claims
- 0463US5011793AVacuum deposition using pressurized reflow processULVAC CORP·Filed 1990·Granted Apr 30, 1991·35 cites·9 claims
- 0550US5753090ASmall size sputtering target and high vacuum sputtering apparatus using the sameULVAC CORP·Filed 1996·Granted May 19, 1998·16 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →