Inventor · disambiguated record
Hideo Otsuka
Also filed as: OTSUKA HIDEO
8 granted patents·1 pending application·166 citations·filing 1981–2020
87Inventor score
Files withFURUKAWA CIRCUIT FOIL3STANLEY ELECTRIC CO LTD2CIRCUIT FOIL JAPAN1FURUKAWA ELECTRIC CO LTD1TOKYO SHIBAURA ELECTRIC CO1
Top patents by PatentIndex Score
9 records- 0187US5834140AElectrodeposited copper foil for fine pattern and method for producing the sameCIRCUIT FOIL JAPAN·Filed 1996·Granted Nov 10, 1998·78 cites·15 claims
- 0272US9080742B2Near infrared illuminatorSTANLEY ELECTRIC CO LTD·Filed 2013·Granted Jul 14, 2015·4 cites·17 claims
- 0369US5829623AEasily openable can lidTOYO SEIKAN KAISHA LTD·Filed 1993·Granted Nov 3, 1998·51 cites·31 claims
- 0467US11686450B2Vehicle lampSTANLEY ELECTRIC CO LTD·Filed 2020·Granted Jun 27, 2023·1 cites·5 claims
- 0564US7215235B2Conductive substrate with resistance layer, resistance board, and resistance circuit boardFURUKAWA CIRCUIT FOIL·Filed 2004·Granted May 8, 2007·6 cites·10 claims
- 0657US7172818B2Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit boardFURUKAWA CIRCUIT FOIL·Filed 2003·Granted Feb 6, 2007·8 cites·7 claims
- 0750US4401506AProcess for producing semiconductor deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1981·Granted Aug 30, 1983·17 cites·11 claims
- 0844US7794578B2Method for preparing a circuit board material having a conductive base and a resistance layerFURUKAWA ELECTRIC CO LTD·Filed 2003·Granted Sep 14, 2010·1 cites·7 claims
- 0944US2004029006A1Electrodeposited copper foil and electrodeposited copper foil for secondary battery collectorFURUKAWA CIRCUIT FOIL·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →