Inventor · disambiguated record
Hidetaka Shigi
Also filed as: SHIGI HIDETAKA
18 granted patents·3 pending applications·426 citations·filing 1988–2009
95Inventor score
Top patents by PatentIndex Score
21 records- 0189US6305230B1Connector and probing systemHITACHI LTD·Filed 1998·Granted Oct 23, 2001·79 cites·14 claims
- 0288US6506982B1Multi-layer wiring substrate and manufacturing method thereofHITACHI LTD·Filed 2000·Granted Jan 14, 2003·39 cites·11 claims
- 0385US5868949AMetalization structure and manufacturing method thereofHITACHI LTD·Filed 1995·Granted Feb 9, 1999·93 cites·36 claims
- 0479US6455335B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2000·Granted Sep 24, 2002·17 cites·10 claims
- 0577US6566150B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2002·Granted May 20, 2003·15 cites·1 claims
- 0676US6759258B2Connection device and test systemRENESAS TECH CORP·Filed 2001·Granted Jul 6, 2004·14 cites·17 claims
- 0773US5162240AMethod and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrateHITACHI LTD·Filed 1990·Granted Nov 10, 1992·47 cites·37 claims
- 0864US7541202B2Connection device and test systemRENESAS TECH CORP·Filed 2007·Granted Jun 2, 2009·1 cites·10 claims
- 0957US4930002AMulti-chip module structureHITACHI LTD·Filed 1988·Granted May 29, 1990·23 cites·4 claims
- 1054US7285430B2Connection device and test systemHITACHI LTD·Filed 2004·Granted Oct 23, 2007·3 cites·8 claims
- 1153US6197603B1Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 1998·Granted Mar 6, 2001·12 cites·4 claims
- 1253US5208656AMultilayer wiring substrate and production thereofHITACHI LTD·Filed 1991·Granted May 4, 1993·23 cites·17 claims
- 1352US2009209053A1Connection device and test systemKASUKABE SUSUMU·Filed 2009·Application pending·0 cites
- 1450US7198962B2Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test stepHITACHI LTD·Filed 2003·Granted Apr 3, 2007·3 cites·5 claims
- 1548US6124553AMultilayer wiring board having vent holes and method of makingHITACHI LTD·Filed 1994·Granted Sep 26, 2000·17 cites·4 claims
- 1644US5262614ACircuit board and sealing structure and methods for manufacturing the sameHITACHI LTD·Filed 1991·Granted Nov 16, 1993·14 cites·16 claims
- 1743US7390732B1Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chipHITACHI LTD·Filed 1998·Granted Jun 24, 2008·12 cites·29 claims
- 1842US5958600ACircuit board and method of manufacturing the sameHITACHI LTD·Filed 1996·Granted Sep 28, 1999·11 cites·23 claims
- 1940US2003019663A1Multi-layer wiring substrate and manufacturing method thereofFiled 2002·Application pending·0 cites
- 2037US2001026444A1Electronic circuit board with built-in thin film capacitor and manufacturing method thereofFiled 2001·Application pending·0 cites
- 2130US5753372AWiring structures and method of manufacturing the sameHITACHI LTD·Filed 1995·Granted May 19, 1998·3 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →