Inventor · disambiguated record
Hironori Shimada
Also filed as: SHIMADA HIRONORI
13 granted patents·7 pending applications·177 citations·filing 1997–2025
90Inventor score
Top patents by PatentIndex Score
20 records- 0196US11555246B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 17, 2023·5 cites·22 claims
- 0293US11935762B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·3 cites·14 claims
- 0390US11450536B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 20, 2022·2 cites·19 claims
- 0487US8395829B2Illuminating device, image reading device, and image forming apparatusTAKAHASHI KAORU·Filed 2010·Granted Mar 12, 2013·10 cites·8 claims
- 0585US11015248B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 25, 2021·3 cites·20 claims
- 0685US8477385B2Image reading apparatus with substrate support, image forming apparatus with substrate supportTAKAHASHI KAORU·Filed 2010·Granted Jul 2, 2013·7 cites·10 claims
- 0783US5947255AMethod of discriminating paper notesGLORY KOGYO KK·Filed 1997·Granted Sep 7, 1999·124 cites·9 claims
- 0877USD939459SBoat for wafer processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Dec 28, 2021·15 cites·1 claims
- 0971US2023112057A1Substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1057US12456636B2Heat insulation structure, substrate processing apparatus, method of manufacturing semiconductor device and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 28, 2025·0 cites·10 claims
- 1157US2025334336A1Substrate Processing Apparatus, Furnace Opening Assembly, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1255US2023332290A1Substrate processing apparatus, nozzle assembly, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1354USD924953SGas inlet attachment for substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jul 13, 2021·6 cites·1 claims
- 1454US2023116953A1Substrate retainer, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1548US7554702B2Image input apparatusFUJI XEROX CO LTD·Filed 2004·Granted Jun 30, 2009·2 cites·16 claims
- 1648US2021207265A1Substrate Processing Apparatus and Reaction TubeKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1747US2022310420A1Cooling method, a method of manufacturing a semiconductor device and a non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1846US2021043485A1Substrate processing apparatus and substrate holderKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1941US8344308B2Image reader and image forming apparatus having a restricting member for restricting deformation of a substrateFUJI XEROX CO LTD·Filed 2010·Granted Jan 1, 2013·0 cites·6 claims
- 2028USD1017561SNozzle holder of substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 12, 2024·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →