Inventor · disambiguated record
Hideki Takagi
Also filed as: TAKAGI HIDEKI
20 granted patents·15 pending applications·262 citations·filing 1993–2022
94Inventor score
Top patents by PatentIndex Score
35 records- 0192US8099982B2Method of molding glass parts and molding apparatusTAKAGI HIDEKI·Filed 2008·Granted Jan 24, 2012·51 cites·22 claims
- 0290US9751754B2Package formation method and MEMS packageNAT INST ADVANCED IND SCIENCE & TECH·Filed 2015·Granted Sep 5, 2017·7 cites·12 claims
- 0390US6280802B1Method of forming film of ultrafine particlesAGENCY IND SCIENCE TECHN·Filed 1999·Granted Aug 28, 2001·85 cites·28 claims
- 0487US7331092B2Method and manufacturing surface acoustic wave deviceFUJITSU MEDIA DEVICES LTD·Filed 2004·Granted Feb 19, 2008·35 cites·3 claims
- 0579US7040963B1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferIBIDEN CO LTD·Filed 2000·Granted May 9, 2006·19 cites·37 claims
- 0678US9349918B2Light emitting element and method for manufacturing sameKASHIMA YUKIO·Filed 2012·Granted May 24, 2016·7 cites·13 claims
- 0775US10189203B2Method for forming micropattern of polyimide using imprintingAIST·Filed 2014·Granted Jan 29, 2019·2 cites·4 claims
- 0875US9929311B2Semiconductor light emitting element and method for producing the sameMARUBUN CO LTD·Filed 2014·Granted Mar 27, 2018·4 cites·1 claims
- 0974US5396039AProcess for assembling piping or components by TIG weldingAIR LIQUIDE·Filed 1993·Granted Mar 7, 1995·33 cites·10 claims
- 1072US7378728B2Electronic component mounting package and package assembled substrateSANYO ELECTRIC CO·Filed 2006·Granted May 27, 2008·6 cites·3 claims
- 1168US9761479B2Manufacturing method for semiconductor substrateTOYOTA JIDOSHOKKI KK·Filed 2014·Granted Sep 12, 2017·2 cites·16 claims
- 1265US8936998B2Manufcaturing method for room-temperature substrate bondingUTSUMI JUN·Filed 2013·Granted Jan 20, 2015·2 cites·10 claims
- 1363US9112035B2Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrateYAMADA HISASHI·Filed 2012·Granted Aug 18, 2015·2 cites·10 claims
- 1462US10112376B2Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2016·Granted Oct 30, 2018·0 cites·13 claims
- 1557US2010276723A1Device and device manufacture methodMITSUBUISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 1655US6509633B1IC package capable of accommodating discrete devicesOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jan 21, 2003·7 cites·20 claims
- 1750US12027440B2Composite having diamond crystal baseAIST·Filed 2020·Granted Jul 2, 2024·0 cites·9 claims
- 1850US8602289B2Room temperature bonding using sputteringGOTO TAKAYUKI·Filed 2007·Granted Dec 10, 2013·0 cites·11 claims
- 1949US2010092786A1Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatusMITSUBISHI HEAVY IND LTD·Filed 2007·Application pending·0 cites
- 2048US2024258195A1Bonded body comprising mosaic diamond wafer and semiconductor of different type, method for producing same, and mosaic diamond wafer for use in bonded body with semiconductor of different typeAIST·Filed 2022·Application pending·0 cites
- 2146US2024149565A1Composite body comprising silicon carbide and method for producing sameAIST·Filed 2022·Application pending·0 cites
- 2245US8608048B2Room-temperature bonding method and room-temperature bonding apparatus including sputteringGOTO TAKAYUKI·Filed 2011·Granted Dec 17, 2013·0 cites·9 claims
- 2345US2013115433A1Micromechanical systemNAT INST OF ADVANCED IND SCIEN·Filed 2013·Application pending·0 cites
- 2445US2015155165A1Method of producing composite wafer and composite waferSUMITOMO CHEMICAL CO·Filed 2014·Application pending·0 cites
- 2544US12389520B2Plasma source, and atomic clock employing plasma sourceAIST·Filed 2022·Granted Aug 12, 2025·0 cites·16 claims
- 2644US2005260938A1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferOKUDA YUJI·Filed 2005·Application pending·0 cites
- 2744US2007196659A1Carbon gel composite materialTOYOTA CHUO KENKYUSHO KK·Filed 2005·Application pending·0 cites
- 2843US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 2941US2023170276A1Diamond composite and method of manufacturing the sameNATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCINCE AND TECH·Filed 2021·Application pending·0 cites
- 3039US2005260930A1Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferOKUDA YUJI·Filed 2005·Application pending·0 cites
- 3136US2019172813A1Substrate joining methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2017·Application pending·0 cites
- 3235US2010213811A1Package for light emitting element and method for manufacturing sameSANYO ELECTRIC CO·Filed 2010·Application pending·0 cites
- 3332US2010182791A1Package for light emitting element and light emitting deviceSANYO ELECTRIC CO·Filed 2010·Application pending·0 cites
- 3432US2010181105A1Package for electron element and electronic componentSANYO ELECTRIC CO·Filed 2010·Application pending·0 cites
- 3532US2010246135A1Electronic deviceSANYO ELECTRIC CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →