Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer

Abstract

A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.

1 . A method for performing polishing using a table having a polishing surface for polishing a semiconductor wafer held by a wafer holding plate of a wafer polishing apparatus, wherein the table includes a plurality of superimposed bases, each base being formed from silicide ceramic or carbide ceramic, wherein at least one of the bases has a fluid passage formed in its superimposition interface, the method comprising the steps of: 
 rotating the semiconductor wafer; and    contacting the semiconductor wafer with the polishing surface of the table while circulating coolant water in the fluid passage.    
     
     
         2 . A method for manufacturing a semiconductor wafer comprising the step of: 
 performing polishing using a table having a polishing surface for polishing a semiconductor wafer held by a wafer holding plate of a wafer polishing apparatus, wherein the table includes a plurality of superimposed bases, each base being formed from silicide ceramic or carbide ceramic, wherein at least one of the bases has a fluid passage formed in its superimposition interface, wherein the polishing step includes the steps of: 
 rotating the semiconductor wafer; and  
 contacting the semiconductor wafer with the polishing surface of the table while circulating coolant water in the fluid passage.  
   
     
     
         3 . A method for manufacturing a table having a polishing surface for polishing a semiconductor wafer held by a wafer holding plate of a wafer polishing apparatus, the method comprising the steps of: 
 arranging a foil-like brazing filler between a plurality of bases, each having a groove formed in its surface and each formed from a silicon carbide sinter; and    heating each of the bases to braze the bases together.