Inventor · disambiguated record
Hilton T. Toy
Also filed as: TOY HILTON · TOY HILTON T
86 granted patents·3 pending applications·1,932 citations·filing 1995–2021
99Inventor score
Top patents by PatentIndex Score
89 records- 0198US7808781B2Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirementsIBM·Filed 2008·Granted Oct 5, 2010·47 cites·14 claims
- 0298US7516776B2Microjet module assemblyIBM·Filed 2005·Granted Apr 14, 2009·68 cites·2 claims
- 0397US7992627B2Microjet module assemblyIBM·Filed 2008·Granted Aug 9, 2011·55 cites·21 claims
- 0497US5931222AAdhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using sameIBM·Filed 1997·Granted Aug 3, 1999·150 cites·13 claims
- 0595US10541156B1Multi integrated circuit chip carrier packageIBM·Filed 2018·Granted Jan 21, 2020·16 cites·20 claims
- 0695US9089052B2Multichip module with stiffening frame and associated coversIBM·Filed 2014·Granted Jul 21, 2015·17 cites·8 claims
- 0794US10757833B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Aug 25, 2020·7 cites·17 claims
- 0894US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 0994US7518235B2Method and structure to provide balanced mechanical loading of devices in compressively loaded environmentsIBM·Filed 2005·Granted Apr 14, 2009·42 cites·6 claims
- 1094US7031162B2Method and structure for cooling a dual chip module with one high power chipIBM·Filed 2003·Granted Apr 18, 2006·97 cites·19 claims
- 1193US7405247B2Conductive adhesive compositionIBM·Filed 2007·Granted Jul 29, 2008·26 cites·1 claims
- 1293US6294408B1Method for controlling thermal interface gap distanceIBM·Filed 1999·Granted Sep 25, 2001·156 cites·18 claims
- 1393US5956576AEnhanced protection of semiconductors with dual surface sealIBM·Filed 1996·Granted Sep 21, 1999·142 cites·42 claims
- 1491US10172258B2Cooling structure for electronic boardsIBM·Filed 2017·Granted Jan 1, 2019·5 cites·10 claims
- 1589US7268428B2Thermal paste containment for semiconductor modulesIBM·Filed 2005·Granted Sep 11, 2007·25 cites·6 claims
- 1689US6218730B1Apparatus for controlling thermal interface gap distanceIBM·Filed 1999·Granted Apr 17, 2001·88 cites·10 claims
- 1788US10424527B2Electronic package with tapered pedestalIBM·Filed 2017·Granted Sep 24, 2019·5 cites·20 claims
- 1888US7393419B2Conductive adhesive rework methodIBM·Filed 2007·Granted Jul 1, 2008·14 cites·8 claims
- 1987US9721870B2Cooling structure for electronic boardsIBM·Filed 2014·Granted Aug 1, 2017·5 cites·16 claims
- 2087US7768121B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2007·Granted Aug 3, 2010·13 cites·14 claims
- 2187US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 2287US5744752AHermetic thin film metallized sealband for SCM and MCM-D modulesIBM·Filed 1995·Granted Apr 28, 1998·82 cites·10 claims
- 2385US9089051B2Multichip module with stiffening frame and associated coversIBM·Filed 2013·Granted Jul 21, 2015·6 cites·12 claims
- 2484US8445331B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2012·Granted May 21, 2013·6 cites·17 claims
- 2584US5821161ACast metal seal for semiconductor substrates and process thereofIBM·Filed 1997·Granted Oct 13, 1998·79 cites·21 claims
- 2683US5982038ACast metal seal for semiconductor substratesIBM·Filed 1997·Granted Nov 9, 1999·71 cites·17 claims
- 2782US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 2881US7312261B2Thermal interface adhesive and reworkIBM·Filed 2004·Granted Dec 25, 2007·24 cites·1 claims
- 2981US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 3080US10424494B2Chip module with stiffening frame and orthogonal heat spreaderIBM·Filed 2017·Granted Sep 24, 2019·2 cites·7 claims
- 3180US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 3280US7319591B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2005·Granted Jan 15, 2008·7 cites·10 claims
- 3379US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 3478US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 3577US9583408B1Reducing directional stress in an orthotropic encapsulation member of an electronic packageIBM·Filed 2015·Granted Feb 28, 2017·3 cites·15 claims
- 3677US6451155B1Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assemblyIBM·Filed 1996·Granted Sep 17, 2002·31 cites·10 claims
- 3775US6459160B1Package with low stress hermetic sealIBM·Filed 2002·Granted Oct 1, 2002·19 cites·26 claims
- 3874US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 3974US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 4073US10593564B2Lid attach optimization to limit electronic package warpageIBM·Filed 2018·Granted Mar 17, 2020·1 cites·6 claims
- 4173US8531025B2Thermal paste containment for semiconductor modulesEDWARDS DAVID L·Filed 2007·Granted Sep 10, 2013·9 cites·15 claims
- 4272US10083886B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 4372US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 4472US8021925B2Thermal paste containment for semiconductor modulesIBM·Filed 2007·Granted Sep 20, 2011·9 cites·16 claims
- 4571US10128590B2Pluggable LGA socket for high density interconnectsIBM·Filed 2015·Granted Nov 13, 2018·2 cites·10 claims
- 4671US6342407B1Low stress hermetic sealIBM·Filed 2000·Granted Jan 29, 2002·15 cites·20 claims
- 4771US6333460B1Structural support for direct lid attachIBM·Filed 2000·Granted Dec 25, 2001·18 cites·6 claims
- 4869US8592970B2Multichip electronic packages and methods of manufactureSIKKA KAMAL K·Filed 2011·Granted Nov 26, 2013·3 cites·24 claims
- 4969US8587114B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2010·Granted Nov 19, 2013·2 cites·19 claims
- 5069US6046074AHermetic thin film metallized sealband for SCM and MCM-D modulesIBM·Filed 1996·Granted Apr 4, 2000·33 cites·12 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →