Inventor · disambiguated record
Hiroshi Tsujimoto
Also filed as: TSUJIMOTO HIROSHI
27 granted patents·21 pending applications·64 citations·filing 2001–2025
93Inventor score
Top patents by PatentIndex Score
48 records- 0192US8858754B2Plasma processing apparatusHORIGUCHI MASATO·Filed 2011·Granted Oct 14, 2014·30 cites·2 claims
- 0284US8383000B2Substrate processing apparatus, method for measuring distance between electrodes, and storage medium storing programTOKYO ELECTRON LTD·Filed 2010·Granted Feb 26, 2013·7 cites·11 claims
- 0382US8277673B2Plasma processing method and apparatusTSUJIMOTO HIROSHI·Filed 2009·Granted Oct 2, 2012·10 cites·10 claims
- 0476US8328981B2Method for heating a focus ring in a plasma apparatus by high frequency power while no plasma being generatedTSUJIMOTO HIROSHI·Filed 2010·Granted Dec 11, 2012·4 cites·8 claims
- 0572US2025166975A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0671US9455125B2Substrate processing apparatusYOSHIMURA AKIHIRO·Filed 2011·Granted Sep 27, 2016·3 cites·10 claims
- 0770US9960016B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2017·Granted May 1, 2018·1 cites·5 claims
- 0868US8070972B2Etching method and etching apparatusTSUJIMOTO HIROSHI·Filed 2007·Granted Dec 6, 2011·3 cites·3 claims
- 0968US2022157567A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1067US10480978B2Method for inspecting flow rate controller and method for processing workpieceTOKYO ELECTRON LTD·Filed 2018·Granted Nov 19, 2019·1 cites·9 claims
- 1165US9524847B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Dec 20, 2016·1 cites·9 claims
- 1264US9818582B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2016·Granted Nov 14, 2017·1 cites·7 claims
- 1364US2025349523A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1463US12387914B2Upper electrode assemblyTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·16 claims
- 1561US10410840B2Gas supplying method and semiconductor manufacturing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Sep 10, 2019·1 cites·6 claims
- 1661US9583315B2Plasma etching apparatus and plasma etching methodTOKYO ELECTRON LTD·Filed 2014·Granted Feb 28, 2017·1 cites·6 claims
- 1760US2024222090A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1857US10861675B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Dec 8, 2020·0 cites·3 claims
- 1957US7569478B2Method and apparatus for manufacturing semiconductor device, control program and computer storage mediumTOKYO ELECTRON LTD·Filed 2006·Granted Aug 4, 2009·1 cites·10 claims
- 2056US10269539B2Plasma processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Apr 23, 2019·0 cites·8 claims
- 2156US9947510B2Method for supplying gas, and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Apr 17, 2018·0 cites·10 claims
- 2256US2025218725A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2354US11557498B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jan 17, 2023·0 cites·17 claims
- 2452US11676800B2Substrate processing apparatus and control method of substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jun 13, 2023·0 cites·8 claims
- 2552US2022403518A1Shower head and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2650US2018166257A1Method for supplying gas, and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 2749US12217942B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Feb 4, 2025·0 cites·6 claims
- 2849US10204763B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2015·Granted Feb 12, 2019·0 cites·5 claims
- 2948US2022301832A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3048US2025174434A1Plasma processing apparatus and power supply systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3148US2025183012A1Plasma processing apparatus and electrostatic chuckTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 3247US2015144266A1Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 3347US2007084562A1Plasma processing chamberTOKYO ELECTRON LTD·Filed 2006·Application pending·0 cites
- 3446US10867778B2Cleaning method and processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Dec 15, 2020·0 cites·9 claims
- 3546US2021305022A1Edge ring, substrate support, plasma processing system and method of replacing edge ringTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 3646US2010041240A1Focus ring, plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 3744US12354841B2Substrate processing device, substrate processing system, control method for substrate processing device, and control method for substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Jul 8, 2025·0 cites·14 claims
- 3844US8592319B2Substrate processing method and substrate processing apparatusWADA NOBUHIRO·Filed 2011·Granted Nov 26, 2013·0 cites·7 claims
- 3943US9728418B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Aug 8, 2017·0 cites·8 claims
- 4041US9904299B2Gas supply control methodTOKYO ELECTRON LTD·Filed 2016·Granted Feb 27, 2018·0 cites·6 claims
- 4141US2004046720A1Image display apparatus and control method thereofFiled 2003·Application pending·0 cites
- 4240US2019237305A1Method for applying dc voltage and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 4339US2011303643A1Substrate processing method and substrate processing apparatusWADA NOBUHIRO·Filed 2011·Application pending·0 cites
- 4438US2003016198A1Image display and control method thereofFiled 2001·Application pending·0 cites
- 4537US10163607B2Temperature control method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Dec 25, 2018·0 cites·8 claims
- 4637US2007144289A1GearO OKA CORP·Filed 2006·Application pending·0 cites
- 4734US2021043431A1Plasma etching method and plasma etching deviceTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 4829US2015243489A1Cleaning method for plasma processing apparatusTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →