Inventor · disambiguated record
Hirohisa Yamazaki
Also filed as: YAMAZAKI HIROHISA
26 granted patents·20 pending applications·808 citations·filing 2002–2025
95Inventor score
Files withHITACHI INT ELECTRIC INC18KOKUSAI ELECTRIC CORP14SAKAI MASANORI3YAMAZAKI HIROHISA3MIYA HIRONOBU2
Top patents by PatentIndex Score
46 records- 0198US10297440B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted May 21, 2019·345 cites·7 claims
- 0298US6686281B2Method for fabricating a semiconductor device and a substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2002·Granted Feb 3, 2004·383 cites·10 claims
- 0395US8461062B2Substrate processing apparatus and method for manufacturing semiconductor deviceSAKAI MASANORI·Filed 2011·Granted Jun 11, 2013·10 cites·8 claims
- 0494US11542603B2Substrate processing apparatus, method of manufacturing semiconductor device and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 3, 2023·2 cites·16 claims
- 0592US11293096B2Substrate processing apparatus, method for manufacturing semiconductor device and vaporizerHITACHI INT ELECTRIC INC·Filed 2018·Granted Apr 5, 2022·8 cites·12 claims
- 0692US8828141B2Substrate processing apparatus and method for manufacturing semiconductor deviceSAKAI MASANORI·Filed 2009·Granted Sep 9, 2014·11 cites·21 claims
- 0789US10707074B2Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 7, 2020·5 cites·5 claims
- 0885US10214313B2BottleOSHINO TADAYOSHI·Filed 2012·Granted Feb 26, 2019·12 cites·6 claims
- 0984US8420552B2Method of manufacturing a semiconductor deviceTAKEBAYASHI YUJI·Filed 2010·Granted Apr 16, 2013·6 cites·2 claims
- 1083US8741063B2Substrate processing apparatus and method of manufacturing semiconductor deviceYAMAZAKI HIROHISA·Filed 2009·Granted Jun 3, 2014·10 cites·10 claims
- 1181US10910217B2Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 2, 2021·1 cites·4 claims
- 1280US12234550B2Vaporizer, processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1378US2025308945A1Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1477US12473648B2Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Nov 18, 2025·0 cites·14 claims
- 1577US8641829B2Substrate processing systemHITACHI INT ELECTRIC INC·Filed 2013·Granted Feb 4, 2014·1 cites·3 claims
- 1676US8481434B2Method of manufacturing a semiconductor device and processing apparatusMIYA HIRONOBU·Filed 2008·Granted Jul 9, 2013·6 cites·15 claims
- 1775US9401282B2Method of manufacturing semiconductor device, cleaning method, substrate processing apparatus and non-transitory computer readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 26, 2016·3 cites·15 claims
- 1871US11970771B2Vaporizer, substrate processing apparatus and method for manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 30, 2024·0 cites·22 claims
- 1969US9768012B2Method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 19, 2017·1 cites·19 claims
- 2068US11873555B2Vaporizer, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 2168US2009197424A1Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 2267US7662727B2Method for manufacturing semiconductor device backgroundHITACHI INT ELECTRIC INC·Filed 2007·Granted Feb 16, 2010·2 cites·7 claims
- 2365US8741731B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 3, 2014·1 cites·17 claims
- 2464US12354887B2Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 8, 2025·0 cites·15 claims
- 2564US8506714B2Substrate processing systemHORITA TOMOKI·Filed 2007·Granted Aug 13, 2013·1 cites·8 claims
- 2663US2025149331A1Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2759US2024105461A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2858US2025118567A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2957US9206931B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Dec 8, 2015·0 cites·7 claims
- 3057US2010009079A1Method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3156US2007262490A1Polyethylene terephthalate resin containerYOSHINO KOGYOSHO CO LTD·Filed 2007·Application pending·0 cites
- 3254US2022403511A1Substrate processing apparatus, exhaust device and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3354US2023098746A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3452US8598047B2Substrate processing apparatus and producing method of semiconductor deviceSAKAI MASANORI·Filed 2011·Granted Dec 3, 2013·0 cites·9 claims
- 3547US11866822B2Vaporizer, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 9, 2024·0 cites·14 claims
- 3647US2009071505A1Cleaning method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 3746US2008166886A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 3846US2012079985A1Method for processing substrate and substrate processing apparatusYAMAZAKI HIROHISA·Filed 2011·Application pending·0 cites
- 3946US2010186774A1Cleaning method and substrate processing apparatusMIYA HIRONOBU·Filed 2008·Application pending·0 cites
- 4044US2010162952A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 4144US2005123698A1Container prepared from polythylene terephthalate resinFiled 2003·Application pending·0 cites
- 4244US2006258174A1Substrate treatment apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2004·Application pending·0 cites
- 4343US2014182515A1Substrate processing apparatus, method of manufacturing semiconductor device and vaporization systemHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 4437US2018286725A1Substrate retrainer and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 4537US2012280369A1Method for manufacturing semiconductor device, substrate processing apparatus, and semiconductor deviceSAITO TATSUYUKI·Filed 2010·Application pending·0 cites
- 4634US2012319252A1Method for manufacturing semiconductor device, substrate processing apparatus, and semiconductor deviceYAMAZAKI HIROHISA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →