Inventor · disambiguated record
Howard Grunes
Also filed as: GRUNES HOWARD · GRUNES HOWARD E
29 granted patents·14 pending applications·3,679 citations·filing 1981–2013
98Inventor score
Top patents by PatentIndex Score
43 records- 0199US5656093AWafer spacing mask for a substrate support chuck and method of fabricating sameAPPLIED MATERIALS INC·Filed 1996·Granted Aug 12, 1997·849 cites·29 claims
- 0299US5186718AStaged-vacuum wafer processing system and methodAPPLIED MATERIALS INC·Filed 1991·Granted Feb 16, 1993·998 cites·23 claims
- 0396US5228501APhysical vapor deposition clamping mechanism and heater/coolerAPPLIED MATERIALS INC·Filed 1992·Granted Jul 20, 1993·357 cites·24 claims
- 0495US6640151B1Multi-tool control system, method and mediumAPPLIED MATERIALS INC·Filed 1999·Granted Oct 28, 2003·167 cites·24 claims
- 0594US6486444B1Load-lock with external staging areaAPPLIED MATERIALS INC·Filed 2000·Granted Nov 26, 2002·101 cites·38 claims
- 0694US6468353B1Method and apparatus for improved substrate handlingAPPLIED MATERIALS INC·Filed 2000·Granted Oct 22, 2002·78 cites·11 claims
- 0794US5763851ASlotted RF coil shield for plasma deposition systemAPPLIED MATERIALS INC·Filed 1996·Granted Jun 9, 1998·93 cites·64 claims
- 0894US5447409ARobot assemblyAPPLIED MATERIALS INC·Filed 1994·Granted Sep 5, 1995·144 cites·5 claims
- 0993US7422637B2Processing chamber configured for uniform gas flowAPPLIED MATERIALS INC·Filed 2006·Granted Sep 9, 2008·14 cites·19 claims
- 1093US7048837B2End point detection for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2003·Granted May 23, 2006·68 cites·26 claims
- 1193US6824612B2Electroless plating systemAPPLIED MATERIALS INC·Filed 2001·Granted Nov 30, 2004·67 cites·24 claims
- 1292US5690795AScrewless shield assembly for vacuum processing chambersAPPLIED MATERIALS INC·Filed 1995·Granted Nov 25, 1997·139 cites·16 claims
- 1389US6368469B1Coils for generating a plasma and for sputteringAPPLIED MATERIALS INC·Filed 1997·Granted Apr 9, 2002·48 cites·54 claims
- 1488US7138014B2Electroless deposition apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Nov 21, 2006·37 cites·38 claims
- 1588US6575737B1Method and apparatus for improved substrate handlingAPPLIED MATERIALS INC·Filed 2000·Granted Jun 10, 2003·45 cites·9 claims
- 1688US6254746B1Recessed coil for generating a plasmaAPPLIED MATERIALS INC·Filed 1997·Granted Jul 3, 2001·47 cites·60 claims
- 1787US6783639B2Coils for generating a plasma and for sputteringAPPLIED MATERIALS INC·Filed 2002·Granted Aug 31, 2004·21 cites·32 claims
- 1887US4393663ATwo-phase thermosyphon heaterGAS RES INST·Filed 1981·Granted Jul 19, 1983·54 cites·12 claims
- 1985US8398832B2Coils for generating a plasma and for sputteringNULMAN JAIM·Filed 2005·Granted Mar 19, 2013·10 cites·25 claims
- 2084US5810931AHigh aspect ratio clamp ringAPPLIED MATERIALS INC·Filed 1996·Granted Sep 22, 1998·78 cites·34 claims
- 2180US6799939B2Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafersAPPLIED MATERIALS INC·Filed 2003·Granted Oct 5, 2004·16 cites·10 claims
- 2279US5387067ADirect load/unload semiconductor wafer cassette apparatus and transfer systemAPPLIED MATERIALS INC·Filed 1993·Granted Feb 7, 1995·59 cites·20 claims
- 2373US5484011AMethod of heating and cooling a wafer during semiconductor processingAPPLIED MATERIALS INC·Filed 1994·Granted Jan 16, 1996·52 cites·8 claims
- 2469US5857368AApparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusionAPPLIED MATERIALS INC·Filed 1995·Granted Jan 12, 1999·37 cites·90 claims
- 2565US5879127ARobot assemblyAPPLIED MATERIALS INC·Filed 1997·Granted Mar 9, 1999·22 cites·1 claims
- 2663US5868847AClamp ring for shielding a substrate during film layer depositionAPPLIED MATERIALS INC·Filed 1994·Granted Feb 9, 1999·34 cites·14 claims
- 2760US5556248ASemiconductor wafer cassette transfer systemAPPLIED MATERIALS INC·Filed 1995·Granted Sep 17, 1996·21 cites·24 claims
- 2854US6409890B1Method and apparatus for forming a uniform layer on a workpiece during sputteringAPPLIED MATERIALS INC·Filed 1999·Granted Jun 25, 2002·10 cites·48 claims
- 2952US5678980ARobot assemblyAPPLIED MATERIALS INC·Filed 1995·Granted Oct 21, 1997·13 cites·12 claims
- 3050US2013168232A1Coils for generating a plasma and for sputteringNULMAN JAIM·Filed 2013·Application pending·0 cites
- 3147US2005199489A1Electroless deposition apparatusAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3247US2004069227A1Processing chamber configured for uniform gas flowAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3346US2004256217A1Coils for generating a plasma and for sputteringFiled 2004·Application pending·0 cites
- 3443US2004083021A1Multi-tool control system, method and mediumAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 3542US2003196901A1Method for plating metal onto wafersAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3642US2002127091A1Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafersFiled 2001·Application pending·0 cites
- 3741US2002170672A1Method and apparatus for improved substrate handlingFiled 2002·Application pending·0 cites
- 3841US2001019016A1Recessed coil for generating a plasmaFiled 2001·Application pending·0 cites
- 3939US2002029936A1Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafersFiled 2001·Application pending·0 cites
- 4037US2004005211A1Multiple independent robot assembly and apparatus and control system for processing and transferring semiconductor wafersFiled 2002·Application pending·0 cites
- 4137US2004055893A1Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4236US2001041121A1Single chamber vacuum processing toolFiled 2001·Application pending·0 cites
- 4336US2002006322A1Pod door openerAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →