Inventor · disambiguated record
Hon-Huei Liu
Also filed as: LIU HON-HUEI
15 granted patents·5 pending applications·25 citations·filing 2015–2025
88Inventor score
Files withUNITED MICROELECTRONICS CORP20
Top patents by PatentIndex Score
20 records- 0195US9502410B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·13 cites·8 claims
- 0291US9455194B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 27, 2016·7 cites·6 claims
- 0383US12289088B2Surface acoustic wave device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 29, 2025·1 cites·16 claims
- 0483US2025293663A1Surface acoustic wave device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0581US9508715B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·3 cites·19 claims
- 0673US2024334710A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0772US11387148B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 12, 2022·0 cites·10 claims
- 0871US9583394B2Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 28, 2017·1 cites·10 claims
- 0970US12348214B2Surface acoustic wave device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 1, 2025·0 cites·4 claims
- 1067US12041784B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 16, 2024·0 cites·5 claims
- 1167US11450747B2Semiconductor structure with an epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 20, 2022·0 cites·9 claims
- 1264US10692777B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 23, 2020·0 cites·6 claims
- 1359US10068808B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 4, 2018·0 cites·8 claims
- 1457US11011376B2Method of manufacturing semiconductor structure with an epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 18, 2021·0 cites·7 claims
- 1556US9502252B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·8 claims
- 1652US2023099443A1Semiconductor structure and the forming method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 1745US10418290B2Method of patterning semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 17, 2019·0 cites·20 claims
- 1840US9530646B2Method of forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·18 claims
- 1936US2017365675A1Dummy pattern arrangement and method of arranging dummy patternsUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2036US2017062615A1Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →