Inventor · disambiguated record
Ho Young Son
Also filed as: SON HO YOUNG
20 granted patents·8 pending applications·66 citations·filing 2006–2024
93Inventor score
Top patents by PatentIndex Score
28 records- 0194US11823982B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2023·Granted Nov 21, 2023·2 cites·20 claims
- 0293US12009308B2Semiconductor chip including through electrodes, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Jun 11, 2024·2 cites·38 claims
- 0391US11594471B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Feb 28, 2023·2 cites·20 claims
- 0488US8310045B2Semiconductor package with heat dissipation devicesSON HO YOUNG·Filed 2011·Granted Nov 13, 2012·11 cites·20 claims
- 0587US8154135B2Stacked semiconductor packageKIM JONG HOON·Filed 2009·Granted Apr 10, 2012·15 cites·18 claims
- 0686US7446384B2CMOS image sensor module with wafersKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Nov 4, 2008·15 cites·9 claims
- 0784US12500176B2Semiconductor chip including through electrodes, and semiconductor package including the sameSK HYNIX INC·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
- 0884US12463114B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2024·Granted Nov 4, 2025·0 cites·17 claims
- 0982US12327779B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 1078US9141828B2Mobile device management apparatus and method based on security policies and management server for mobile device managementJUNG HYUN-WOO·Filed 2012·Granted Sep 22, 2015·7 cites·17 claims
- 1178US8816477B2Semiconductor package having a contamination preventing layer formed in the semiconductor chipSON HO YOUNG·Filed 2012·Granted Aug 26, 2014·4 cites·14 claims
- 1273US9570370B2Multi chip package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted Feb 14, 2017·3 cites·5 claims
- 1369US8669642B2Semiconductor chip and fabricating method thereofSON HO YOUNG·Filed 2012·Granted Mar 11, 2014·2 cites·20 claims
- 1464US9159709B2Semiconductor chip and stacked semiconductor package having the sameSK HYNIX INC·Filed 2014·Granted Oct 13, 2015·1 cites·9 claims
- 1564US9040419B2Semiconductor package and method for manufacturing the sameSK HYNIX INC·Filed 2014·Granted May 26, 2015·1 cites·10 claims
- 1656US10407388B2Thiourea derivatives as activators of RORα and pharmaceutical composition containing sameLEE MI OCK·Filed 2012·Granted Sep 10, 2019·1 cites·10 claims
- 1752US11502051B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Nov 15, 2022·0 cites·26 claims
- 1851US10014278B2Semiconductor chip and stacked semiconductor package having the sameSK HYNIX INC·Filed 2015·Granted Jul 3, 2018·0 cites·19 claims
- 1949US2013161826A1Semiconductor chip and stacked semiconductor package having the sameSON HO YOUNG·Filed 2012·Application pending·0 cites
- 2047US8217434B2Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the sameSON HO YOUNG·Filed 2009·Granted Jul 10, 2012·0 cites·8 claims
- 2145US2009042336A1Fabrication method of an organic substrate having embedded active-chipsPAIK KYUNG-WOOK·Filed 2008·Application pending·0 cites
- 2244US2007259515A1Method for manufacturing wafer-level packages for flip chips capable of preventing adhesives from absorbing waterKOREA ADVANCED INST SCI & TECH·Filed 2007·Application pending·0 cites
- 2342US2014264848A1Semiconductor package and method for fabricating the sameSK HYNIX INC·Filed 2014·Application pending·0 cites
- 2442US2007054419A1Wafer level chip size package for CMOS image sensor module and manufacturing method thereofPAIK KYUNG-WOOK·Filed 2006·Application pending·0 cites
- 2541US9736023B2Apparatus and method for changing status of cluster nodes, and recording medium having the program recorded thereinSAMSUNG SDS CO LTD·Filed 2014·Granted Aug 15, 2017·0 cites·18 claims
- 2641US2014264833A1Semiconductor package and method for fabricating the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 2738US2012112360A1Semiconductor chip, stacked semiconductor package having the same, and method for manufacturing stacked semiconductor packageSON HO YOUNG·Filed 2011·Application pending·0 cites
- 2834US2017179078A1Semiconductor packages and methods of manufacturing the sameSK HYNIX INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →