Inventor · disambiguated record
Ho-Ming Tong
Also filed as: TONG HO J · TONG HO M · TONG HO-MING
59 granted patents·43 pending applications·1,962 citations·filing 1985–2025
99Inventor score
Top patents by PatentIndex Score
102 records- 0199US6224690B1Flip-Chip interconnections using lead-free soldersIBM·Filed 1996·Granted May 1, 2001·191 cites·12 claims
- 0299US5433651AIn-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishingIBM·Filed 1993·Granted Jul 18, 1995·758 cites·51 claims
- 0393US5503286AElectroplated solder terminalIBM·Filed 1994·Granted Apr 2, 1996·131 cites·16 claims
- 0492US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0591US7041534B2Semiconductor chip package and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 9, 2006·70 cites·10 claims
- 0691US5629564AElectroplated solder terminalIBM·Filed 1995·Granted May 13, 1997·111 cites·21 claims
- 0783US5274913AMethod of fabricating a reworkable moduleIBM·Filed 1991·Granted Jan 4, 1994·86 cites·4 claims
- 0881US6864168B2Bump and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·25 cites·9 claims
- 0981US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 1080US6819002B2Under-ball-metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 16, 2004·28 cites·19 claims
- 1180US2025385203A1Semiconductor package and semiconductor package assembly with edge side interconnection and method of forming the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 1277US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 1376US4970868AApparatus for temperature control of electronic devicesIBM·Filed 1989·Granted Nov 20, 1990·46 cites·16 claims
- 1475US7614888B2Flip chip package processADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 10, 2009·7 cites·12 claims
- 1575US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 1674US5169805AMethod of resiliently mounting an integrated circuit chip to enable conformal heat dissipationIBM·Filed 1991·Granted Dec 8, 1992·51 cites·8 claims
- 1774US2025174539A13d integrated circuit package and substrate structure thereofND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 1873US7547575B2Two-stage die-bonding method for simultaneous die-bonding of multiple diesADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 16, 2009·7 cites·6 claims
- 1972US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 2072US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 2172US2024047298A1Semiconductor structureND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2272US2024047192A1Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2371US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 2470US12442835B2Probe card system, method of manufacturing probe card system, method of using probe card systemND HI TECH LAB INC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 2569US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 2669US6768332B2Semiconductor wafer and testing method for the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·16 cites·14 claims
- 2769US2024128146A1Semiconductor package for enhanced coolingND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2869US2024128208A1Semiconductor package and semiconductor package assembly with edge side interconnection and method of forming the sameND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2969US2024128150A1Semiconductor package structure for enhanced coolingND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 3068US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 3167US12469836B2High bandwidth memory stack with side edge interconnection and 3D IC structure with the sameND HI TECH LAB INC·Filed 2025·Granted Nov 11, 2025·0 cites·18 claims
- 3263US5117275AElectronic substrate multiple location conductor attachment technologyIBM·Filed 1990·Granted May 26, 1992·28 cites·12 claims
- 3362US5057909AElectronic device and heat sink assemblyIBM·Filed 1991·Granted Oct 15, 1991·32 cites·8 claims
- 3462US4690836AProcess for the production of void-free prepreg sheetsIBM·Filed 1985·Granted Sep 1, 1987·18 cites·7 claims
- 3561US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 3661US6891360B1Plated probe structureIBM·Filed 1998·Granted May 10, 2005·22 cites·7 claims
- 3761US2024421027A1Semiconductor package structure for enhanced coolingND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 3861US2025038067A1Semiconductor deviceND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 3960US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 4059US5546655AMethod of applying flex tape protective coating onto a flex productIBM·Filed 1994·Granted Aug 20, 1996·21 cites·25 claims
- 4159US2024379498A1Semiconductor package for liquid immersion cooling and method of forming the sameND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 4259US2024379636A1Semiconductor device package and method of manufacturing the sameND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 4357US8258009B2Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereofLEE CHIH-CHENG·Filed 2010·Granted Sep 4, 2012·1 cites·10 claims
- 4457US2024234354A1Semiconductor package and method for manufacturing the sameND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 4556US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 4656US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 4756US2024006301A1Semiconductor packageND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 4855US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 4955US7581666B2Wire-bonding method for wire-bonding apparatusADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 1, 2009·1 cites·6 claims
- 5055US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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