Inventor · disambiguated record
Hsin Chang
Also filed as: CHANG HSIN · CHANG HSIN-CHUN
19 granted patents·3 pending applications·209 citations·filing 1999–2024
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15TAIWAN SEMICONDUCTOR MFG3CHANG HSIN2LIN JING-CHENG1NAILERMATE ENTERPRISE CORP1
Top patents by PatentIndex Score
22 records- 0198US8643148B2Chip-on-Wafer structures and methods for forming the sameLIN JING-CHENG·Filed 2012·Granted Feb 4, 2014·116 cites·19 claims
- 0295US8928159B2Alignment marks in substrate having through-substrate via (TSV)CHANG HSIN·Filed 2010·Granted Jan 6, 2015·29 cites·20 claims
- 0389US11616002B2Through-circuit vias in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
- 0485US9123643B2Chip-on-wafer structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Sep 1, 2015·4 cites·20 claims
- 0584US8567837B2Reconfigurable guide pin design for centering wafers having different sizesCHANG HSIN·Filed 2010·Granted Oct 29, 2013·6 cites·13 claims
- 0681US10692764B2Alignment marks in substrate having through-substrate via (TSV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·2 cites·20 claims
- 0780US2024213180A1Interconnect structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0879US12293959B2Through-circuit Vias in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 0979US10777510B2Semiconductor device including dummy via anchored to dummy metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 15, 2020·2 cites·19 claims
- 1078US2024387331A1Through-Circuit Vias In Interconnect StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1176US11955441B2Interconnect structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 1276US8962481B2Chip-on-wafer structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 24, 2015·3 cites·20 claims
- 1375US12243805B2Through-circuit vias in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1470US11302654B2Method of fabricating semiconductor device including dummy via anchored to dummy metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 1570US10910267B2Alignment marks in substrate having through-substrate via (TSV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 2, 2021·0 cites·20 claims
- 1668US10163706B2Alignment marks in substrate having through-substrate via (TSV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·1 cites·19 claims
- 1768US6059161AAssembly of a power staplerNAILERMATE ENTERPRISE CORP·Filed 1999·Granted May 9, 2000·44 cites·5 claims
- 1853US9099515B2Reconfigurable guide pin design for centering wafers having different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·0 cites·19 claims
- 1952US2023402384A1Graphene-metal hybrid interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2050US9941159B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·0 cites·20 claims
- 2148US9449919B2Semiconductor device, layout design and method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·0 cites·20 claims
- 2243US10431541B2Semiconductor device, layout pattern and method for manufacturing an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →