Inventor · disambiguated record
Hsih-Yang Chiu
Also filed as: CHIU HSIH-YANG
118 granted patents·44 pending applications·44 citations·filing 2018–2025
99Inventor score
Files withNANYA TECHNOLOGY CORP162
Top patents by PatentIndex Score
162 records- 0195US12068203B2Method for manufacturing semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 20, 2024·2 cites·2 claims
- 0295US12062656B2Semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 13, 2024·2 cites·12 claims
- 0395US11967612B2Method of manufacturing semiconductor structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Apr 23, 2024·2 cites·12 claims
- 0494US11876077B2Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Jan 16, 2024·3 cites·9 claims
- 0593US12482768B2Semiconductor structure having protective layer on sidewall of conductive member and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 25, 2025·1 cites·14 claims
- 0693US2025393185A1Method for manufacturing a semiconductor device including buried word lineNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0792US12457733B2Semiconductor device having bonding structure and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 28, 2025·1 cites·15 claims
- 0892US11594541B2One-time programmable memory array and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 28, 2023·2 cites·11 claims
- 0991US11842979B2Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 12, 2023·2 cites·5 claims
- 1091US11183502B1Memory cell and Method for reading out data therefromNANYA TECHNOLOGY CORP·Filed 2020·Granted Nov 23, 2021·2 cites·16 claims
- 1189US10607924B1Semiconductor package structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Mar 31, 2020·6 cites·20 claims
- 1288US11107730B1Method of manufacturing semiconductor device with anti-fuse structuresNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 31, 2021·2 cites·10 claims
- 1387US12178039B2Memory device having merged active areaNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 24, 2024·1 cites·20 claims
- 1487US10522466B1Semiconductor structure and method for manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2018·Granted Dec 31, 2019·4 cites·10 claims
- 1586US11189562B1Interconnection structure having increased conductive features and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Nov 30, 2021·2 cites·7 claims
- 1686US10636811B1Semiconductor structure and method for manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2018·Granted Apr 28, 2020·4 cites·7 claims
- 1786US2025060405A1Testing moduleNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1886US2025344369A1Semiconductor device having semiconductor channel layer and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1985US12354949B2Method of forming electrical fuse matrixNANYA TECHNOLOGY CORP·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 2085US2024410934A1Semiconductor waferNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2184US12374609B2Integrated circuit package structure with conductive stair structureNANYA TECHNOLOGY CORP·Filed 2024·Granted Jul 29, 2025·0 cites·19 claims
- 2283US11664364B2Semiconductor device with through semiconductor via and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 2382US12262551B2Method of manufacturing semiconductor structureNANYA TECHNOLOGY CORP·Filed 2024·Granted Mar 25, 2025·0 cites·18 claims
- 2482US2025309160A1Semiconductor structure having protective layer on sidewall of conductive member and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2581US2024312929A1Interconnect structureNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2681US2025125257A1Semiconductor structure having fuse below gate structure and method of manufacturing thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2780US12283567B2Method of manufacturing semiconductor device having air cavityNANYA TECHNOLOGY CORP·Filed 2024·Granted Apr 22, 2025·0 cites·12 claims
- 2880US12191303B2Semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2024·Granted Jan 7, 2025·0 cites·9 claims
- 2980US2025239547A1Semiconductor device structure having hybrid bond structure with air gap and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3079US12278179B2Semiconductor structure having fuse below gate structure and method of manufacturing thereofNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 15, 2025·0 cites·4 claims
- 3179US12250808B2Semiconductor device with programmable structure and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2024·Granted Mar 11, 2025·0 cites·7 claims
- 3279US11984389B2Integrated circuit package structure with conductive stair structure and method of manufacturing thereofNANYA TECHNOLOGY CORP·Filed 2023·Granted May 14, 2024·0 cites·5 claims
- 3379US2025014824A1Capacitor structureNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3478US12295137B2Method of manufacturing tsemiconductor device having bonding structureNANYA TECHNOLOGY CORP·Filed 2023·Granted May 6, 2025·0 cites·13 claims
- 3578US12027575B2Method for fabricating semiconductor structureNANYA TECHNOLOGY CORP·Filed 2023·Granted Jul 2, 2024·0 cites·15 claims
- 3678US2025234511A1Method of manufacturing semiconductor device having bonding structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3777US12493071B2Semiconductor wafer and testing moduleNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 9, 2025·0 cites·7 claims
- 3877US12406933B2Semiconductor device including through-insulator via structureNANYA TECHNOLOGY CORP·Filed 2023·Granted Sep 2, 2025·0 cites·16 claims
- 3977US10811382B1Method of manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2019·Granted Oct 20, 2020·2 cites·15 claims
- 4077US2025239544A1Semiconductor device structure having hybrid bond structure with air gap and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4177US2025125258A1Method for fabricating semiconductor device with fuse structureNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4277US2025096174A1Semiconductor structure having copper pillar within solder bump and manufacturing method thereofNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4377US2025239546A1Semiconductor device structure having hybrid bond structure with air gap and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4477US2024321942A1Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4576US12506069B2Semiconductor structure having fuse below gate structure and method of manufacturing thereofNANYA TECHNOLOGY CORP·Filed 2022·Granted Dec 23, 2025·0 cites·17 claims
- 4676US12317579B2Method for manufacturing semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2024·Granted May 27, 2025·0 cites·7 claims
- 4776US12278211B2Manufacturing method of semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 15, 2025·0 cites·7 claims
- 4876US12033956B2Interconnect structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Jul 9, 2024·0 cites·10 claims
- 4976US11955427B2Method of forming electrical fuse matrixNANYA TECHNOLOGY CORP·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 5076US2025017002A1Semiconductor device structure including fuse structure embedded in substrateNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 162 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →