Inventor · disambiguated record
Hsiang-Ming Huang
Also filed as: HUANG HSIANG Y · HUANG HSIANG-MING
13 granted patents·15 pending applications·95 citations·filing 2005–2019
90Inventor score
Files withCHIPMOS TECHNOLOGIES INC8WANG DAVID WEI5CHIPMOS TECHNOLOGIES BERMUDA4LIU AN HONG3HUANG HSIANG-MING2
Top patents by PatentIndex Score
28 records- 0191US7973310B2Semiconductor package structure and method for manufacturing the sameCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Jul 5, 2011·37 cites·44 claims
- 0288US8269352B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·10 cites·13 claims
- 0388US7372286B2Modular probe cardCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 13, 2008·17 cites·6 claims
- 0485US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
- 0568US10568663B2Spinal surgical instrument, method of guiding thereof and system for bone stabilizationWILTROM CO LTD·Filed 2017·Granted Feb 25, 2020·1 cites·15 claims
- 0668US8269351B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·2 cites·11 claims
- 0768US8264068B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 11, 2012·2 cites·9 claims
- 0868US7368809B2Pillar grid array packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 6, 2008·4 cites·7 claims
- 0966US7642639B2COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the sameCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 5, 2010·3 cites·24 claims
- 1066US7316065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jan 8, 2008·4 cites·5 claims
- 1156US2020008841A1Spinal surgical instrument, method of guiding thereof and system for bone stabilizationWILTROM CO LTD·Filed 2019·Application pending·0 cites
- 1253US2007148095A1Fluorescent magnetic nanoparticles with specific targeting functionsIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1346US2007080452A1Bump structure and its forming methodCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 1445US7477065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Jan 13, 2009·1 cites·6 claims
- 1544US2011291268A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 1644US2011291267A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 1742US8993342B2Magnetic separation unit, magnetic separation device and method for separating magnetic substance in bio-samplesTUNG MEAN-JUE·Filed 2011·Granted Mar 31, 2015·0 cites·23 claims
- 1842US7906333B2Surface modification of polysaccharide, the modified polysaccharide, and method of culturing and recovery cells using the sameIND TECH RES INST·Filed 2006·Granted Mar 15, 2011·0 cites·14 claims
- 1941US2006231750A1Image sensor module packageCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2041US2009236741A1Conductive structure of a chip and method for manufacturing the sameHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 2141US2009283905A1Conductive structure of a chipHUANG HSIANG-MING·Filed 2008·Application pending·0 cites
- 2238US2007222465A1Probe head with vertical probes, method for manufacturing the probe head and probe card using the probe headCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2337US2008124828A1Fabrication processes of a MEMS alloy probeCHIPMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 2437US2007085554A1Replaceable modular probe headCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 2534US2006022317A1Chip-under-tape package structure and manufacture thereofLIU AN-HONG·Filed 2005·Application pending·0 cites
- 2634US2013119530A1Thermally enhanced packaging structureLIU AN HONG·Filed 2012·Application pending·0 cites
- 2733US2013049787A1Method of testing stacked semiconductor device structureYI CHI-MING·Filed 2012·Application pending·0 cites
- 2832US2013069228A1Flip-chip package structure and forming method thereofLIU AN-HONG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →