Inventor · disambiguated record
Hsi-Shan Kuo
Also filed as: KUO HSI-SHAN
6 granted patents·2 pending applications·152 citations·filing 1998–2011
86Inventor score
Top patents by PatentIndex Score
8 records- 0193US7208834B2Bonding structure with pillar and capMEGICA CORP·Filed 2004·Granted Apr 24, 2007·59 cites·32 claims
- 0292US6784087B2Method of fabricating cylindrical bonding structureMEGIC CORP·Filed 2002·Granted Aug 31, 2004·60 cites·23 claims
- 0391US8461679B2Method for fabricating circuit componentLEE JIN-YUAN·Filed 2011·Granted Jun 11, 2013·9 cites·22 claims
- 0490US7960270B2Method for fabricating circuit componentMEGICA CORP·Filed 2007·Granted Jun 14, 2011·14 cites·9 claims
- 0567US8890336B2Cylindrical bonding structure and method of manufactureLEE JIN-YUAN·Filed 2008·Granted Nov 18, 2014·2 cites·20 claims
- 0639US6032704AMethod and apparatus for storing wafers without moisture absorptionTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Mar 7, 2000·8 cites·17 claims
- 0739US2003127734A1Cylindrical bonding structure and method of manufactureFiled 2002·Application pending·0 cites
- 0836US2003148631A1Oxidative annealing method for forming etched spin-on-glass (SOG) planarizing layer with uniform etch profileTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →