Inventor · disambiguated record
Hsueh-An Yang
Also filed as: YANG HSUEH-AN
19 granted patents·4 pending applications·109 citations·filing 2004–2016
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG7TAIWAN SEMICONDUCTOR MFG4WALSIN LIHWA CORP3YANG HSUEH-AN3ADVANCE SEMICONDUCTOR ENGINEERING INC1
Top patents by PatentIndex Score
23 records- 0195US7681779B2Method for manufacturing electric connections in waferADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Mar 23, 2010·25 cites·11 claims
- 0294US7706149B2Micro-electro-mechanical-system package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Apr 27, 2010·38 cites·14 claims
- 0387US8810027B2Bond ring for a first and second substrateCHENG CHUN-WEN·Filed 2010·Granted Aug 19, 2014·9 cites·16 claims
- 0486US8836116B2Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substratesYANG HSUEH-AN·Filed 2010·Granted Sep 16, 2014·8 cites·20 claims
- 0579US8368152B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·4 cites·20 claims
- 0679US8277667B2Magnetic element and manufacturing method thereforYANG HSUEH-AN·Filed 2008·Granted Oct 2, 2012·9 cites·5 claims
- 0776US8633554B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 21, 2014·3 cites·13 claims
- 0870US8114699B2Integration manufacturing process for MEMS deviceWU MIGCHING·Filed 2011·Granted Feb 14, 2012·2 cites·5 claims
- 0968US7651888B2Wafer lever fixture and method for packaging micro-electro-mechanical-system devicesADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jan 26, 2010·3 cites·18 claims
- 1066US7945062B2Microelectromechanical microphone packaging systemADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 17, 2011·3 cites·7 claims
- 1166US7501342B2Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Mar 10, 2009·2 cites·11 claims
- 1265US9240348B2Method of making a semiconductor device packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 19, 2016·1 cites·20 claims
- 1363US8030111B2Integration manufacturing process for MEMS deviceWALSIN LIHWA CORP·Filed 2008·Granted Oct 4, 2011·2 cites·16 claims
- 1456US9056766B2Method of forming a bond ring for a first and second substrateTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 16, 2015·0 cites·21 claims
- 1553US9502334B2Method of making a semiconductor device package with dummy gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·0 cites·20 claims
- 1652US8263493B2Silicon chip having through via and method for making the sameYANG HSUEH-AN·Filed 2009·Granted Sep 11, 2012·0 cites·16 claims
- 1749US2005280116A1Integration manufacturing process for MEMS deviceWALSIN LIHWA CORP·Filed 2005·Application pending·0 cites
- 1848US2013032889A1Silicon Chip Having Through Via and Method for Making the SameADVANCE SEMICONDUCTOR ENGINEERING INC·Filed 2012·Application pending·0 cites
- 1947US8318511B2Integration manufacturing process for MEMS deviceWU MINGCHING·Filed 2012·Granted Nov 27, 2012·0 cites·6 claims
- 2047US7863181B2Method for manufacturing a device having a high aspect ratio viaADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jan 4, 2011·0 cites·15 claims
- 2146US2008188026A1Method for manufacturing a semiconductor package structure having micro-electro-mechanical systemsADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2243US2008197951A1Driving method for magnetic elementUNIV TSINGHUA·Filed 2007·Application pending·0 cites
- 2340US7196449B2Two-axis device and manufacturing method thereforWALSIN LIHWA CORP·Filed 2004·Granted Mar 27, 2007·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →