Inventor · disambiguated record
Hsiu-Mei Yu
Also filed as: YU HSIU-MEI
27 granted patents·4 pending applications·600 citations·filing 1994–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG16VANGUARD INT SEMICONDUCT CORP7TAIWAN SEMICONDUCTOR MFG CO LTD4HSIEH MING-CHANG1HUANG HON-LIN1
Top patents by PatentIndex Score
31 records- 0196US8048778B1Methods of dicing a semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 1, 2011·36 cites·20 claims
- 0296US7863742B2Back end integrated WLCSP structure without aluminum padsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 4, 2011·72 cites·20 claims
- 0395US8624392B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 7, 2014·34 cites·20 claims
- 0494US9870975B1Chip package with thermal dissipation structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·12 cites·20 claims
- 0594US7364998B2Method for forming high reliability bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 29, 2008·38 cites·12 claims
- 0692US6593220B1Elastomer plating mask sealed wafer level package methodTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 15, 2003·144 cites·37 claims
- 0791US7378724B2Cavity structure for semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 27, 2008·24 cites·16 claims
- 0885US7968431B2Diffusion region routing for narrow scribe-line devicesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jun 28, 2011·11 cites·18 claims
- 0984US5393697AComposite bump structure and methods of fabricationIND TECH RES INST·Filed 1994·Granted Feb 28, 1995·91 cites·22 claims
- 1082US6541366B1Method for improving a solder bump adhesion bond to a UBM contact layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 1, 2003·48 cites·20 claims
- 1178US7456090B2Method to reduce UBM undercutTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 25, 2008·11 cites·20 claims
- 1275US6486054B1Method to achieve robust solder bump heightTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 26, 2002·25 cites·26 claims
- 1372US6696356B2Method of making a bump on a substrate without ribbon residueTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 24, 2004·23 cites·30 claims
- 1470US10797007B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·1 cites·20 claims
- 1570US8669641B2Diffusion region routing for narrow scribe-line devicesHSIEH MING-CHANG·Filed 2011·Granted Mar 11, 2014·3 cites·18 claims
- 1670US2025022766A1Semiconductor deviceVANGUARD INT SEMICONDUCT CORP·Filed 2024·Application pending·0 cites
- 1769US6624060B2Method and apparatus for pretreating a substrate prior to electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 23, 2003·22 cites·18 claims
- 1866US12131973B2Semiconductor device and method forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2022·Granted Oct 29, 2024·0 cites·12 claims
- 1966US11810804B2Method of forming dice and structure of dieVANGUARD INT SEMICONDUCT CORP·Filed 2022·Granted Nov 7, 2023·0 cites·15 claims
- 2060US11309201B2Method of forming dice and structure of dieVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Apr 19, 2022·0 cites·6 claims
- 2157US7781140B2Method of fine pitch bump strippingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 24, 2010·1 cites·20 claims
- 2256US9087882B2Electrical connection for chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·0 cites·20 claims
- 2356US2025157899A1Package structure and fabrication method thereofVANGUARD INT SEMICONDUCT CORP·Filed 2023·Application pending·0 cites
- 2453US11588036B2High-efficiency packaged chip structure and electronic device including the sameVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Feb 21, 2023·0 cites·13 claims
- 2551US9515038B2Electrical connection for chip scale packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·20 claims
- 2649US11935878B2Package structure and method for manufacturing the sameVANGUARD INT SEMICONDUCT CORP·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 2747US10157839B1Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 2842US2008303154A1Through-silicon via interconnection formed with a cap layerHUANG HON-LIN·Filed 2007·Application pending·0 cites
- 2941US6941957B2Method and apparatus for pretreating a substrate prior to electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 13, 2005·4 cites·9 claims
- 3039US2008251916A1UBM structure for strengthening solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 3138US7714414B2Method and apparatus for polymer dielectric surface recovery by ion implantationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 11, 2010·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →