Inventor · disambiguated record
Hung Hoang
Also filed as: HOANG HUNG · HOANG HUNG THE · HOANG HUNG X
1 granted patent·5 pending applications·0 citations·filing 2004–2018
9Inventor score
Files withBEST INC2APPLIED MATERIALS INC1BUSINESS ELECTRONICS SOLDERING1SAMSUNG ELECTRONICS CO LTD1ZHENG BO1
Top patents by PatentIndex Score
6 records- 0143US11386719B2Electronic device and operating method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 12, 2022·0 cites·20 claims
- 0234US2007232072A1Formation of protection layer on wafer to prevent stain formationZHENG BO·Filed 2006·Application pending·0 cites
- 0334US2010147928A1Method for the manual placement of bottom terminated leadless device electronic packages using a mated stencil pairBUSINESS ELECTRONICS SOLDERING·Filed 2009·Application pending·0 cites
- 0433US2008308612A1Manual method for reballing using a solder preformBEST INC·Filed 2008·Application pending·0 cites
- 0531US2005020077A1Formation of protection layer by dripping DI on wafer with high rotation to prevent stain formation from H2O2/H2SO4 chemical splashAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 0628US2011132972A1Manual method for reballing using a solder preformBEST INC·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →