Inventor · disambiguated record
Hung-Chia Tsai
Also filed as: TSAI HUNG-CHIA
18 granted patents·116 citations·filing 2012–2020
93Inventor score
Top patents by PatentIndex Score
18 records- 0197US9725310B2Micro electromechanical system sensor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·14 cites·20 claims
- 0297US9085456B2Support structure for TSV in MEMS structureTSAI YI HENG·Filed 2012·Granted Jul 21, 2015·53 cites·20 claims
- 0395US9919914B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·9 cites·20 claims
- 0491US8941152B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·11 cites·20 claims
- 0588US9352956B2MEMS devices and methods for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·5 cites·20 claims
- 0687US10710871B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
- 0785US10508023B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 0883US10155659B2Vacuum sealed MEMS and CMOS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 0982US9403674B2Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·6 cites·18 claims
- 1079US9776856B2Vacuum sealed MEMS and CMOS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 3, 2017·4 cites·20 claims
- 1175US9150404B2Semiconductor device with through molding viasTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·3 cites·20 claims
- 1274US9315378B2Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 19, 2016·3 cites·20 claims
- 1373US11117796B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 1470US11014805B2Method of forming semiconductor package and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 1565US9469524B2Semiconductor device with through molding vias and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·1 cites·20 claims
- 1663US10384933B2Method of forming micro electromechanical system sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·0 cites·20 claims
- 1755US9422153B2Support structure for TSV in MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·20 claims
- 1854US9617143B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 11, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →