Inventor · disambiguated record
Hyosang Lee
Also filed as: LEE HYOSANG · LEE HYOSANG S
9 granted patents·11 pending applications·118 citations·filing 1994–2025
86Inventor score
Files withFUJIFILM ELECTRONIC MAT USA INC8HYUNDAI MOTOR CO LTD3MAX PLANCK GESELLSCHAFT3NOVELLUS SYSTEMS INC2FUJIFILM PLANAR SOLUTIONS LLC1
Top patents by PatentIndex Score
20 records- 0187US5718407APower unit mounting systemHYUNDAI MOTOR CO LTD·Filed 1995·Granted Feb 17, 1998·58 cites·4 claims
- 0281US12319843B2Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 0378US9816196B2Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 14, 2017·1 cites·19 claims
- 0477US10676646B2Chemical mechanical polishing slurry for cobalt applicationsFUJIFILM PLANAR SOLUTIONS LLC·Filed 2018·Granted Jun 9, 2020·1 cites·17 claims
- 0577US2025277136A1Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
- 0671US12024650B2Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Jul 2, 2024·0 cites·21 claims
- 0771US5558316AHydro-mount for power plantHYUNDAI MOTOR CO LTD·Filed 1995·Granted Sep 24, 1996·36 cites·8 claims
- 0868US7120058B2Circuit and method for controlling boosting voltageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 10, 2006·10 cites·28 claims
- 0963US2018030611A1Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2017·Application pending·0 cites
- 1060US2025101263A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 1157US2023193168A1Method of reducing defects on polished wafersFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 1256US2024002696A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 1355US8461763B2Electron cyclotron ion source and manufacturing method thereofWON MI-SOOK·Filed 2009·Granted Jun 11, 2013·3 cites·12 claims
- 1454US2025257286A1Cleaning compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
- 1549US2024044729A1System and Method for Simultaneously Sensing Contact Force and Lateral StrainMAX PLANCK GESELLSCHAFT·Filed 2021·Application pending·0 cites
- 1648US2022306899A1Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 1742US2012064462A1By-product mitigation in through-silicon-via platingWILLEY MARK J·Filed 2011·Application pending·0 cites
- 1840US2023306261A1Method for force inference of a sensor arrangement, methods for training networks, force inference module and sensor arrangementMAX PLANCK GESELLSCHAFT·Filed 2020·Application pending·0 cites
- 1937US5549284AHydraulically controlled engine mounting device of an automotive vehicleHYUNDAI MOTOR CO LTD·Filed 1994·Granted Aug 27, 1996·9 cites·10 claims
- 2037US2024011853A1Sensor arrangement for sensing forces and method for fabricating a sensor arrangementMAX PLANCK GESELLSCHAFT·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →