Inventor · disambiguated record
Hyosan Lee
Also filed as: LEE HYOSAN
28 granted patents·20 pending applications·256 citations·filing 2003–2025
95Inventor score
Top patents by PatentIndex Score
48 records- 0195US8076198B2Method of fabricating nonvolatile memory deviceLEE HYOSAN·Filed 2010·Granted Dec 13, 2011·199 cites·11 claims
- 0291US11390805B2Etching composition and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·3 cites·20 claims
- 0391US10361100B2Apparatus and methods for treating a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 23, 2019·7 cites·19 claims
- 0488US9595434B2Apparatus and methods for manufacturing semiconductor devices and treating substratesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 14, 2017·6 cites·18 claims
- 0585US11795550B2Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·6 claims
- 0684US11028488B2Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 8, 2021·3 cites·17 claims
- 0784US10388537B2Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 20, 2019·3 cites·21 claims
- 0882US9941110B2Manufacturing method and fluid supply system for treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 10, 2018·3 cites·12 claims
- 0981US10155903B2Metal etchant compositions and methods of fabricating a semiconductor device using the sameLEE HYOSAN·Filed 2016·Granted Dec 18, 2018·3 cites·17 claims
- 1081US9831081B2Method for treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·3 cites·19 claims
- 1181US9534839B2Apparatus and methods for treating a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jan 3, 2017·5 cites·17 claims
- 1281US9153597B2Methods of manufacturing a three-dimensional semiconductor deviceKIM YOUNG-HOO·Filed 2012·Granted Oct 6, 2015·6 cites·14 claims
- 1378US10991600B2Process chamber and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 27, 2021·2 cites·20 claims
- 1476US9852921B2Substrate treating apparatus and method of treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 26, 2017·2 cites·18 claims
- 1576US9677002B2Etching compositionSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·2 cites·6 claims
- 1676US9524864B2Manufacturing method and fluid supply system for treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 20, 2016·3 cites·10 claims
- 1768US12234400B2Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·13 claims
- 1867US11610788B2Process chamber and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 1964US9165759B2Etching composition and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 20, 2015·1 cites·15 claims
- 2064US2023332015A1Slurry composition for polishing metal and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2163US2021098261A1Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 2261US2025163323A1Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2359US2024318078A1Etching composition for titanium-containing layer, etching method of etching titanium-containing layer, and method of manufacturing semiconductor device using the etching compositionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US12319841B2Slurry composition for chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·21 claims
- 2557US8183141B2Methods of forming semiconductor devicesHYUN SANGJIN·Filed 2009·Granted May 22, 2012·1 cites·16 claims
- 2656US2023383218A1Cleaning composition for removing residues on surface, method of cleaning metal-containing film by using the same, and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2755US2023407174A1Etching composition, method of etching metal-containing film by using the same, and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2854US2018315613A1Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2951US2025277149A1Etching composition and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3051US2015368557A1Metal etchant compositions and methods of fabricating a semiconductor device using the sameLEE HYOSAN·Filed 2014·Application pending·0 cites
- 3150US10186427B2Substrate treating apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 22, 2019·0 cites·14 claims
- 3250US2024059967A1Etching composition and method of manufacturing integrated circuits using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3350US2023272278A1Etching composition for etching molybdenum film and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3449US10837115B2Pre-treatment composition before etching SiGe and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·10 claims
- 3548US11189503B2Substrate drying method, photoresist developing method, photolithography method including the same, and substrate drying systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·17 claims
- 3648US9934959B2Method and apparatus for purifying cleaning agentSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 3, 2018·0 cites·13 claims
- 3748US2021403756A1Slurry composition for chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 3847US11427759B2Etchant compositions for metal-containing films and methods of manufacturing integrated circuit devices using the etchant compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 3947US7431855B2Apparatus and method for removing photoresist from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 7, 2008·3 cites·36 claims
- 4045US2009065032A1Apparatus and method for removing photoresist from a substrateHAN DONGGYUN·Filed 2008·Application pending·0 cites
- 4142US11168253B2Silicon layer etchant composition and method of forming pattern by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·4 claims
- 4242US2012214296A1Methods of Forming Semiconductor DevicesHYUN SANGJIN·Filed 2012·Application pending·0 cites
- 4339US2020208052A1Etchant composition for etching metal film and method of forming pattern using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4438US2018151395A1Cleaning composition, cleaning apparatus, and method for manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 4536US2017297164A1Cleaning apparatus and substrate processing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 4635US2016368030A1Liquid chemical supplying system, substrate processing system, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4733US2015343495A1Apparatus and methods for treating substratesKIM KYOUNGSEOB·Filed 2015·Application pending·0 cites
- 4833US2015287590A1Method of rinsing and drying semiconductor device and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →