Inventor · disambiguated record
Hyung Sang Park
Also filed as: PARK HYUNG S · PARK HYUNG SOON · PARK HYUNG-SANG
25 granted patents·19 pending applications·2,787 citations·filing 2000–2025
97Inventor score
Top patents by PatentIndex Score
44 records- 0198US8912101B2Method for forming Si-containing film using two precursors by ALDASM IP HOLDING BV·Filed 2013·Granted Dec 16, 2014·522 cites·17 claims
- 0297USRE47170EMethod of forming semiconductor patternsASM GENITECH KOREA LTD·Filed 2013·Granted Dec 18, 2018·441 cites·72 claims
- 0397US8092606B2Deposition apparatusPARK HYUNG SANG·Filed 2008·Granted Jan 10, 2012·345 cites·19 claims
- 0497US6720262B2Method of forming copper interconnections and thin films using chemical vapor deposition with catalystGENITECH INC·Filed 2000·Granted Apr 13, 2004·335 cites·12 claims
- 0596US8252691B2Method of forming semiconductor patternsBEYNET JULIEN·Filed 2011·Granted Aug 28, 2012·519 cites·14 claims
- 0693US7138336B2Plasma enhanced atomic layer deposition (PEALD) equipment and method of forming a conducting thin film using the same thereofASM GENITECH KOREA LTD·Filed 2001·Granted Nov 21, 2006·139 cites·46 claims
- 0792US8492197B2Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrateCHO SUNGWON·Filed 2010·Granted Jul 23, 2013·14 cites·31 claims
- 0890US8778083B2Lateral-flow deposition apparatus and method of depositing film by using the apparatusKIM KI JONG·Filed 2010·Granted Jul 15, 2014·7 cites·13 claims
- 0990US7976898B2Atomic layer deposition apparatusASM GENITECH KOREA LTD·Filed 2007·Granted Jul 12, 2011·16 cites·9 claims
- 1088US7541284B2Method of depositing Ru films having high densityASM GENITECH KOREA LTD·Filed 2007·Granted Jun 2, 2009·24 cites·32 claims
- 1188US6955691B2Expandable interfusion cageKYUNGWON MEDICAL CO LTD·Filed 2003·Granted Oct 18, 2005·329 cites·2 claims
- 1287US11261523B2Method of depositing silicon oxide filmsASM KOREA LTD·Filed 2020·Granted Mar 1, 2022·2 cites·17 claims
- 1383US6793821B2Super water-repellent organic/inorganic composite membraneKOREA RES INST CHEM TECH·Filed 2002·Granted Sep 21, 2004·36 cites·7 claims
- 1482US8215264B2Atomic layer deposition apparatusHONG KYUNG IL·Filed 2011·Granted Jul 10, 2012·7 cites·11 claims
- 1581US7694928B2Sink type cup holder for motor vehicleHYUNDAI MOTOR CO LTD·Filed 2007·Granted Apr 13, 2010·22 cites·5 claims
- 1679US8076242B2Methods of forming an amorphous silicon thin filmKIM JONG SU·Filed 2009·Granted Dec 13, 2011·6 cites·28 claims
- 1778US8747948B2Deposition apparatusPARK HYUNG SANG·Filed 2012·Granted Jun 10, 2014·1 cites·10 claims
- 1876US8502391B2Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpagePARK HYUNG SANG·Filed 2011·Granted Aug 6, 2013·4 cites·25 claims
- 1974US12188121B2Method of depositing silicon oxide filmsASM KOREA LTD·Filed 2022·Granted Jan 7, 2025·0 cites·25 claims
- 2069US6749242B2Glove box damper systemHYUNDAI MOBIS CO LTD·Filed 2002·Granted Jun 15, 2004·16 cites·2 claims
- 2165US2025379037A1Apparatus for processing substrateISAC RES INC·Filed 2025·Application pending·0 cites
- 2265US2025391643A1Apparatus for processing substrateISAC RES INC·Filed 2025·Application pending·0 cites
- 2363US8896133B2Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrateSTATS CHIPPAC LTD·Filed 2013·Granted Nov 25, 2014·1 cites·25 claims
- 2462US8273408B2Methods of depositing a ruthenium filmKIM JONG SU·Filed 2008·Granted Sep 25, 2012·1 cites·18 claims
- 2560US2024018649A1Powder-Surface Treatment ApparatusHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 2659US11534772B2Trap device for powder coating apparatusHYUNDAI MOTOR CO LTD·Filed 2020·Granted Dec 27, 2022·0 cites·16 claims
- 2757US2009047426A1Deposition apparatusASM GENITECH KOREA LTD·Filed 2008·Application pending·0 cites
- 2857US2009155606A1Methods of depositing a silicon nitride filmASM GENITECH KOREA LTD·Filed 2008·Application pending·0 cites
- 2956US2009041952A1Method of depositing silicon oxide filmsASM GENITECH KOREA LTD·Filed 2008·Application pending·0 cites
- 3052US2020263299A1Surface treatment apparatus for surface-treating powder and method of surface-treating powder using the sameHYUNDAI MOTOR CO LTD·Filed 2019·Application pending·0 cites
- 3150US2007215036A1Method and apparatus of time and space co-divided atomic layer depositionPARK HYUNG-SANG·Filed 2006·Application pending·0 cites
- 3249US12392035B2Powder atomic layer deposition equipment and gas supply method thereforISAC RES INC·Filed 2021·Granted Aug 19, 2025·0 cites·17 claims
- 3348US2006177601A1Method of forming a ruthenium thin film using a plasma enhanced atomic layer deposition apparatus and the method thereofPARK HYUNG-SANG·Filed 2005·Application pending·0 cites
- 3447US2008241384A1Lateral flow deposition apparatus and method of depositing film by using the apparatusASM GENITECH KOREA LTD·Filed 2008·Application pending·0 cites
- 3546US2009163024A1Methods of depositing a ruthenium filmASM GENITECH KOREA LTD·Filed 2008·Application pending·0 cites
- 3646US2008110399A1Atomic layer deposition apparatusASM GENITECH KOREA LTD·Filed 2007·Application pending·0 cites
- 3745US2006276037A1Plasma enhanced atomic layer deposition (PEALD) equipment and method of forming a conducting thin film using the same thereofLEE CHUN S·Filed 2006·Application pending·0 cites
- 3845US2008242078A1Process of filling deep vias for 3-d integration of substratesASM NUTOOL INC·Filed 2007·Application pending·0 cites
- 3944US2007218702A1Semiconductor-processing apparatus with rotating susceptorASM JAPAN·Filed 2007·Application pending·0 cites
- 4042US2007218701A1Semiconductor-processing apparatus with rotating susceptorASM JAPAN·Filed 2006·Application pending·0 cites
- 4138US2005124154A1Method of forming copper interconnections for semiconductor integrated circuits on a substrateFiled 2002·Application pending·0 cites
- 4238US2004203252A1CMP slurry for nitride and CMP method using the sameFiled 2003·Application pending·0 cites
- 4336US2018274096A1System and method for atomic layer depositionISAC RES INC·Filed 2018·Application pending·0 cites
- 4434US8242029B2Method for forming a silicon dioxide/metal oxide-nanolaminate with a desired wet etch rateZAGWIJN PETER·Filed 2009·Granted Aug 14, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →