Inventor · disambiguated record
I-Ming Lai
Also filed as: LAI I-MING
8 granted patents·2 pending applications·33 citations·filing 2011–2024
81Inventor score
Top patents by PatentIndex Score
10 records- 0192US8647953B2Method for fabricating first and second epitaxial cap layersLIAO CHIN-I·Filed 2011·Granted Feb 11, 2014·17 cites·19 claims
- 0285US8710632B2Compound semiconductor epitaxial structure and method for fabricating the sameYU TIEN-WEI·Filed 2012·Granted Apr 29, 2014·13 cites·16 claims
- 0366US2024170299A1Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0464US12494456B2Semiconductor assembly and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 9, 2025·0 cites·9 claims
- 0561US8519390B2Test pattern for measuring semiconductor alloys using X-ray DiffractionLIAO CHIN-I·Filed 2011·Granted Aug 27, 2013·1 cites·20 claims
- 0659US8921206B2Semiconductor processYANG CHAN-LON·Filed 2011·Granted Dec 30, 2014·1 cites·18 claims
- 0759US8716750B2Semiconductor device having epitaxial structuresLIAO CHIN-I·Filed 2011·Granted May 6, 2014·1 cites·19 claims
- 0858US11923205B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·7 claims
- 0947US2014191285A1Semiconductor device having epitaxial structuresUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1043US8445363B2Method of fabricating an epitaxial layerLU TSUO-WEN·Filed 2011·Granted May 21, 2013·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →