Inventor · disambiguated record
Ichio Shimizu
Also filed as: SHIMIZU ICHIO
38 granted patents·8 pending applications·1,193 citations·filing 1976–2015
98Inventor score
Top patents by PatentIndex Score
46 records- 0196US4920074ASurface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereofHITACHI LTD·Filed 1988·Granted Apr 24, 1990·316 cites·15 claims
- 0294US4725692AElectronic device and lead frame used thereonHITACHI LTD·Filed 1986·Granted Feb 16, 1988·89 cites·25 claims
- 0392US6992385B2Semiconductor device, a method of manufacturing the same and an electronic deviceRENESAS TECH CORP·Filed 2004·Granted Jan 31, 2006·47 cites·22 claims
- 0491US7220617B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted May 22, 2007·21 cites·11 claims
- 0587US7432594B2Semiconductor chip, electrically connections thereforRENESAS TECH CORP·Filed 2005·Granted Oct 7, 2008·17 cites·18 claims
- 0686US7405469B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 29, 2008·12 cites·10 claims
- 0786US7374965B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted May 20, 2008·14 cites·22 claims
- 0885US5150193AResin-encapsulated semiconductor device having a particular mounting structureHITACHI LTD·Filed 1991·Granted Sep 22, 1992·107 cites·28 claims
- 0985US5041901ALead frame and semiconductor device using the sameHITACHI LTD·Filed 1990·Granted Aug 20, 1991·82 cites·20 claims
- 1085US4942452ALead frame and semiconductor deviceHITACHI LTD·Filed 1988·Granted Jul 17, 1990·72 cites·23 claims
- 1184US8138600B2Semiconductor device and method of manufacturing the sameMUTO AKIRA·Filed 2007·Granted Mar 20, 2012·18 cites·29 claims
- 1284US6882047B2Semiconductor package including a plurality of semiconductor chips thereinRENESAS TECH CORP·Filed 2002·Granted Apr 19, 2005·38 cites·12 claims
- 1381US7732919B2Semiconductor deviceRENESAS TECH CORP·Filed 2009·Granted Jun 8, 2010·10 cites·22 claims
- 1481US7692285B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Apr 6, 2010·11 cites·13 claims
- 1581US5488254APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1994·Granted Jan 30, 1996·66 cites·21 claims
- 1679US7955902B2Manufacturing method of semiconductor device with surface mounting terminalsRENESAS ELECTRONICS CORP·Filed 2010·Granted Jun 7, 2011·4 cites·10 claims
- 1778US5808359ASemiconductor device having a heat sink with bumpers for protecting outer leadsHITACHI LTD·Filed 1995·Granted Sep 15, 1998·40 cites·6 claims
- 1877US8698289B2Semiconductor device, a method of manufacturing the same and an electronic deviceSATOU YUKIHIRO·Filed 2011·Granted Apr 15, 2014·3 cites·12 claims
- 1976US5047837ASemiconductor device with heat transfer capHITACHI LTD·Filed 1989·Granted Sep 10, 1991·46 cites·4 claims
- 2075US6501160B1Semiconductor device and a method of manufacturing the same and a mount structureHITACHI LTD·Filed 2000·Granted Dec 31, 2002·23 cites·35 claims
- 2174US4095253ASingle in-line high power resin-packaged semiconductor device having an improved heat dissipatorHITACHI LTD·Filed 1976·Granted Jun 13, 1978·33 cites·17 claims
- 2272US8022518B2Semiconductor device having a sealing body and partially exposed conductorsRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 20, 2011·2 cites·12 claims
- 2371US6492739B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2002·Granted Dec 10, 2002·12 cites·7 claims
- 2467US7728416B2Semiconductor device, a method of manufacturing the same and an electronic deviceRENESAS TECH CORP·Filed 2008·Granted Jun 1, 2010·2 cites·13 claims
- 2562US6320270B1Semiconductor device and method of producing the sameHITACHI LTD·Filed 2000·Granted Nov 20, 2001·7 cites·4 claims
- 2660US6849933B2Semiconductor mounting device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 1, 2005·9 cites·10 claims
- 2760US6838315B2Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulatorRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·9 cites·8 claims
- 2859US7969000B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jun 28, 2011·1 cites·3 claims
- 2958USRE37690ELead frame and semiconductor deviceHITACHI LTD·Filed 1995·Granted May 7, 2002·25 cites·48 claims
- 3056US4797787ALead frame and electronic deviceHITACHI LTD·Filed 1985·Granted Jan 10, 1989·9 cites·13 claims
- 3155US6392308B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2001·Granted May 21, 2002·4 cites·6 claims
- 3255US5194935APlastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structureHITACHI LTD·Filed 1991·Granted Mar 16, 1993·23 cites·29 claims
- 3354US7763967B2Semiconductor device with surface mounting terminalsRENESAS TECH CORP·Filed 2008·Granted Jul 27, 2010·0 cites·8 claims
- 3452US4907129ALead frame and electronic diviceHITACHI LTD·Filed 1988·Granted Mar 6, 1990·7 cites·14 claims
- 3551US2008268577A1Semiconductor device and method of manufacturing the sameKAGII HIDEMASA·Filed 2008·Application pending·0 cites
- 3649US2005218494A1Semiconductor device, a method of manufacturing the same and an electronic deviceRENESAS TECH CORP·Filed 2005·Application pending·0 cites
- 3749US2008220568A1Manufacturing method of semiconductor deviceMUTO AKIRA·Filed 2008·Application pending·0 cites
- 3848US2007176266A1Semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 3946US6104085ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1999·Granted Aug 15, 2000·9 cites·11 claims
- 4046US2011156274A1Semiconductor deviceRENESAS TECH CORP·Filed 2011·Application pending·0 cites
- 4145US2008224282A1Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 4245US2005218498A1Semiconductor deviceHATA TOSHIYUKI·Filed 2005·Application pending·0 cites
- 4343US6710429B2Semiconductor device and process for production thereofRENESAS TECH CORP·Filed 2001·Granted Mar 23, 2004·1 cites·5 claims
- 4439US5121300ALead frame and electronic device employing the sameHITACHI LTD·Filed 1990·Granted Jun 9, 1992·4 cites·42 claims
- 4534US9473327B2Radio communication device, radio communication method, and radio communication systemFUJITSU LTD·Filed 2015·Granted Oct 18, 2016·0 cites·20 claims
- 4633US2010181628A1Semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ichio Shimizu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →