Inventor · disambiguated record
In-Seak Hwang
Also filed as: HWANG IN-SEAK
41 granted patents·22 pending applications·517 citations·filing 1999–2017
98Inventor score
Top patents by PatentIndex Score
63 records- 0193US9269720B1Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 23, 2016·11 cites·20 claims
- 0292US9659940B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 23, 2017·10 cites·20 claims
- 0392US6461937B1Methods of forming trench isolation regions having recess-inhibiting layers therein that protect against overetchingSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 8, 2002·78 cites·7 claims
- 0490US9184227B1Methods of manufacturing semiconductor devices having self-aligned contact padsKIM YOUNG-KUK·Filed 2014·Granted Nov 10, 2015·10 cites·13 claims
- 0589US6717231B2Trench isolation regions having recess-inhibiting layers therein that protect against overetchingSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 6, 2004·52 cites·6 claims
- 0687US6548853B1Cylindrical capacitors having a stepped sidewall and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 15, 2003·50 cites·3 claims
- 0786US10109529B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 23, 2018·6 cites·11 claims
- 0886US8604550B2Semiconductor devices including gate structure and method of fabricating the sameLEE KWANG-WOOK·Filed 2011·Granted Dec 10, 2013·10 cites·18 claims
- 0986US6500726B2Shallow trench isolation type semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 31, 2002·44 cites·16 claims
- 1083US6889447B2Method for drying a wafer and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 10, 2005·29 cites·20 claims
- 1182US6700153B2One-cylinder stack capacitor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 2, 2004·32 cites·6 claims
- 1281US9240414B1Semiconductor devices having self-aligned contact padsKIM YOUNG-KUK·Filed 2015·Granted Jan 19, 2016·3 cites·7 claims
- 1379US6802911B2Method for cleaning damaged layers and polymer residue from semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Oct 12, 2004·22 cites·40 claims
- 1476US8723297B2Memory deviceSON YOON-HO·Filed 2011·Granted May 13, 2014·5 cites·15 claims
- 1576US7573132B2Wiring structure of a semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 11, 2009·7 cites·5 claims
- 1675US6331478B1Methods for manufacturing semiconductor devices having chamfered metal silicide layersSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Dec 18, 2001·25 cites·17 claims
- 1774US8748254B2Method of manufacturing semiconductor deviceLEE KWANG-WOOK·Filed 2012·Granted Jun 10, 2014·4 cites·19 claims
- 1873US8551288B2Apparatus and method for removing a photoresist structure from a substrateKIM IN-GI·Filed 2008·Granted Oct 8, 2013·5 cites·19 claims
- 1973US6369008B1Cleaning solutions for removing contaminants from the surfaces of semiconductor substrates and cleaning methods using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 9, 2002·17 cites·14 claims
- 2072US9390961B2Semiconductor devices having plug insulatorsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·4 cites·18 claims
- 2170US10438799B2Methods of fabricating semiconductor devices including support patternsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 8, 2019·1 cites·14 claims
- 2269US6875706B2Cleaning solution and method of cleaning a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 5, 2005·10 cites·15 claims
- 2367US6911364B2One-cylinder stack capacitor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 28, 2005·13 cites·32 claims
- 2465US8058128B2Methods of fabricating recessed channel metal oxide semiconductor (MOS) transistorsLEE KEUM-JOO·Filed 2010·Granted Nov 15, 2011·3 cites·18 claims
- 2564US8962455B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 24, 2015·2 cites·15 claims
- 2664US6146994AMethod for forming self-aligned selective silicide layer using chemical mechanical polishing in merged DRAM logicSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Nov 14, 2000·28 cites·14 claims
- 2762US6699773B2Shallow trench isolation type semiconductor device and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 2, 2004·10 cites·5 claims
- 2856US6831012B2Method for forming a silicide film of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 14, 2004·5 cites·20 claims
- 2953US6838330B2Method of forming a contact hole of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 4, 2005·9 cites·13 claims
- 3052US7405164B2Apparatus and method for removing a photoresist structure from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 29, 2008·0 cites·8 claims
- 3150US9985106B2Semiconductor devices utilizing spacer structuresSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 29, 2018·0 cites·10 claims
- 3249US7338610B2Etching method for manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 4, 2008·2 cites·22 claims
- 3348US7025493B2Chemical supply system and chemical mixing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 11, 2006·2 cites·19 claims
- 3448US6706633B2Method of forming a self-aligned contact pad for use in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 16, 2004·3 cites·9 claims
- 3548US2008214006A1Methods of using corrosion-inhibiting cleaning compositions for metal layers and patterns on semiconductor substratesLEE KWANG-WOOK·Filed 2008·Application pending·0 cites
- 3648US2006287208A1Methods of Forming Corrosion-Inhibiting Cleaning Compositions for Metal Layers and Patterns on Semiconductor SubstratesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3747US6837943B2Method and apparatus for cleaning a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 4, 2005·1 cites·29 claims
- 3847US2010093165A1Method of fabricating integrated circuit semiconductor device having gate metal silicide layerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3947US2005139233A1Cleaning solution and method of cleaning a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4046US7008755B2Method for forming a planarized layer of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 7, 2006·1 cites·18 claims
- 4146US2008102595A1Etching method for manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4245US2008220375A1Methods of reworking a semiconductor substrate and methods of forming a pattern in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4345US2015311297A1Semiconductor device and method of forming thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 4444US6943081B2Method of forming storage nodes comprising a base in a contact hole and related structuresSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 13, 2005·2 cites·5 claims
- 4544US2007138126A1Methods of forming a conductive structureSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4643US9960169B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·0 cites·6 claims
- 4743US7361547B2Method for forming a capacitor for use in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 22, 2008·1 cites·16 claims
- 4843US2005261151A1Corrosion-inhibiting cleaning compositions for metal layers and patterns on semiconductor substratesLEE KWANG-WOOK·Filed 2005·Application pending·0 cites
- 4943US2009133722A1Apparatus and method for cleaning a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 5042US2007004218A1Method of cleaning a semiconductor device and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →