Inventor · disambiguated record
In Soo Kang
Also filed as: KANG IN SOO
9 granted patents·3 pending applications·128 citations·filing 1999–2023
87Inventor score
Files withKANG IN SOO3HYUNDAI ELECTRONICS IND2JAHWA ELECTRONICS CO LTD2NEPES CORP2HYUNDAI ELECTRONICS IND CO INC1
Top patents by PatentIndex Score
12 records- 0192US11860445B2Actuator for driving reflectorJAHWA ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·3 cites·18 claims
- 0283US6492200B1Semiconductor chip package and fabrication method thereofHYUNDAI ELECTRONICS IND CO INC·Filed 1999·Granted Dec 10, 2002·85 cites·37 claims
- 0379US8237276B2Bump structure and fabrication method thereofSONG CHI JUNG·Filed 2010·Granted Aug 7, 2012·8 cites·6 claims
- 0477US12216330B2Actuator for driving reflectorJAHWA ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·4 claims
- 0575US8093721B2Flip chip semiconductor package and fabrication method thereofKANG IN-SOO·Filed 2007·Granted Jan 10, 2012·9 cites·15 claims
- 0674US8421211B2Wafer level semiconductor package and fabrication method thereofKANG IN SOO·Filed 2010·Granted Apr 16, 2013·6 cites·13 claims
- 0765US7952210B2Semiconductor package and fabrication method thereofNEPES CORP·Filed 2008·Granted May 31, 2011·4 cites·16 claims
- 0862US6392287B1Semiconductor package and fabricating method thereofHYUNDAI ELECTRONICS IND·Filed 2000·Granted May 21, 2002·10 cites·5 claims
- 0955US2023216201A1Semiconductor package including antenna and method of manufacturing the semiconductor packageNEPES CO LTD·Filed 2022·Application pending·0 cites
- 1048US6486000B2Semiconductor package and fabricating method thereofHYUNDAI ELECTRONICS IND·Filed 2002·Granted Nov 26, 2002·3 cites·7 claims
- 1145US2009020871A1Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the sameNEPES CORP·Filed 2006·Application pending·0 cites
- 1235US2012146216A1Semiconductor package and fabrication method thereofKANG IN SOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →