Inventor · disambiguated record
Inpil Yoo
Also filed as: YOO INPIL
16 granted patents·10 pending applications·28 citations·filing 2013–2025
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
26 records- 0192US9613885B2Plastic cooler for semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 4, 2017·8 cites·15 claims
- 0291US11984424B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0390US11430777B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 30, 2022·2 cites·16 claims
- 0482US12417999B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 0582US12308364B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 0682US9589922B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·5 cites·5 claims
- 0782US2025279405A1Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0881US10916931B2Temperature sensing and fault detection for paralleled double-side cooled power modulesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 9, 2021·4 cites·25 claims
- 0979US9934990B2Method of manufacturing a cooler for semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 3, 2018·2 cites·15 claims
- 1077US11848320B2Power module package for direct cooling multiple power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1177US11145571B2Heat transfer for power modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
- 1275US2025125297A1Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1372US12266590B2Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1471US12205918B2Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1570US2025233050A1Dual side direct cooling semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1670US2024186211A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1769US9449895B2Cooling system for molded modules and corresponding manufacturing methodsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 20, 2016·3 cites·21 claims
- 1868US12230601B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1966US2025192097A1High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 2063US2022173022A1Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 2160US11264311B2Clips for semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 1, 2022·0 cites·20 claims
- 2257US10199238B2Semiconductor module cooling systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 5, 2019·0 cites·20 claims
- 2357US2022157688A1Direct-cooling for semiconductor device modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 2457US2025105164A1Leadframe-less semiconductor device assemblies with dual-sided coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 2553US2025372533A1Destressing structure for semiconductor packages and method of manufacturing the sameST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 2647US2017154835A1Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →