Inventor · disambiguated record
Ionut Radu
Also filed as: RADU IONUT
43 granted patents·14 pending applications·555 citations·filing 2007–2024
97Inventor score
Top patents by PatentIndex Score
57 records- 0198US8716105B2Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methodsSADAKA MARIAM·Filed 2011·Granted May 6, 2014·219 cites·28 claims
- 0298US8501537B2Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methodsSADAKA MARIAM·Filed 2011·Granted Aug 6, 2013·221 cites·18 claims
- 0396US11711065B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2021·Granted Jul 25, 2023·5 cites·21 claims
- 0496US11367650B2Structures for radiofrequency applications and related methodsSOITEC SILICON ON INSULATOR·Filed 2020·Granted Jun 21, 2022·3 cites·20 claims
- 0596US8461017B2Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened regionSADAKA MARIAM·Filed 2010·Granted Jun 11, 2013·27 cites·21 claims
- 0692US8866305B2Methods of forming bonded semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2013·Granted Oct 21, 2014·12 cites·21 claims
- 0790US9165945B1Method for fabricating semiconductor structures including transistor channels having different strain states, and related semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2014·Granted Oct 20, 2015·8 cites·13 claims
- 0890US9041214B2Bonded processed semiconductor structures and carriersSOITEC SILICON ON INSULATOR·Filed 2013·Granted May 26, 2015·8 cites·20 claims
- 0988US8673733B2Methods of transferring layers of material in 3D integration processes and related structures and devicesSADAKA MARIAM·Filed 2011·Granted Mar 18, 2014·10 cites·26 claims
- 1085US8481406B2Methods of forming bonded semiconductor structuresSADAKA MARIAM·Filed 2010·Granted Jul 9, 2013·7 cites·24 claims
- 1185US2024396520A1Heterostructure and method of fabricationSOITEC SILICON ON INSULATOR·Filed 2024·Application pending·0 cites
- 1284US10608610B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2016·Granted Mar 31, 2020·3 cites·18 claims
- 1383US11637542B2Heterostructure and method of fabricationSOITEC SILICON ON INSULATOR·Filed 2020·Granted Apr 25, 2023·1 cites·23 claims
- 1481US12143093B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2023·Granted Nov 12, 2024·0 cites·14 claims
- 1581US10943815B2Structure for radiofrequency applicationsSOITEC SILICON ON INSULATOR·Filed 2017·Granted Mar 9, 2021·2 cites·19 claims
- 1680US12165900B2Method of mechanical separation for a double layer transferSOITEC SILICON ON INSULATOR·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1780US12101080B2Heterostructure and method of fabricationSOITEC SILICON ON INSULATOR·Filed 2023·Granted Sep 24, 2024·0 cites·19 claims
- 1880US10924081B2Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave deviceSOITEC SILICON ON INSULATOR·Filed 2020·Granted Feb 16, 2021·1 cites·30 claims
- 1980US10826459B2Heterostructure and method of fabricationSOITEC SILICON ON INSULATOR·Filed 2016·Granted Nov 3, 2020·2 cites·13 claims
- 2080US9138980B2Apparatus for manufacturing semiconductor devicesSOITEC SILICON ON INSULATOR·Filed 2012·Granted Sep 22, 2015·3 cites·11 claims
- 2177US12316298B2Surface acoustic wave device including transducer in dielectric between a piezoelectric material and a substrateSOITEC SILICON ON INSULATOR·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 2277US9553014B2Bonded processed semiconductor structures and carriersSOITEC SILICON ON INSULATOR·Filed 2015·Granted Jan 24, 2017·2 cites·19 claims
- 2376US8759881B2Heterostructure for electronic power components, optoelectronic or photovoltaic componentsBETHOUX JEAN-MARC·Filed 2010·Granted Jun 24, 2014·5 cites·19 claims
- 2474US11923239B2Structures for radiofrequency applications and related methodsSOITEC SILICON ON INSULATOR·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 2572US8263475B2Method for manufacturing heterostructuresRADU IONUT·Filed 2009·Granted Sep 11, 2012·4 cites·17 claims
- 2671US11742233B2Method of mechanical separation for a double layer transferSOITEC SILICON ON INSULATOR·Filed 2020·Granted Aug 29, 2023·0 cites·12 claims
- 2770US11595020B2Heterostructure and method of fabricationSOITEC SILICON ON INSULATOR·Filed 2020·Granted Feb 28, 2023·0 cites·27 claims
- 2870US8623740B2Method of detaching semi-conductor layers at low temperatureLANDRU DIDIER·Filed 2009·Granted Jan 7, 2014·6 cites·20 claims
- 2968US11600766B2Method for manufacturing a monocrystalline piezoelectric layerSOITEC SILICON ON INSULATOR·Filed 2016·Granted Mar 7, 2023·1 cites·12 claims
- 3068US2023217832A1Composite substrates including epitaxial monocrystalline piezoelectric layers bonded to substrates, and acoustic wave devices formed with such composite substratesSOITEC SILICON ON INSULATOR·Filed 2023·Application pending·0 cites
- 3167US8993461B2Method for curing defects in a semiconductor layerRADU IONUT·Filed 2012·Granted Mar 31, 2015·4 cites·19 claims
- 3257US9905531B2Method for producing composite structure with metal/metal bondingSOITEC SILICON ON INSULATOR·Filed 2013·Granted Feb 27, 2018·1 cites·9 claims
- 3356US11088016B2Method for locating devicesSOITEC SILICON ON INSULATOR·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 3455US10910250B2Method of mechanical separation for a double layer transferSOITEC SILICON ON INSULATOR·Filed 2016·Granted Feb 2, 2021·0 cites·17 claims
- 3554US11652464B2Surface acoustic wave device and associated production methodSOITEC SILICON ON INSULATOR·Filed 2016·Granted May 16, 2023·0 cites·20 claims
- 3653US2015279830A1Method for bonding semiconductor wafers using a molecular bonding apparatusSOITEC SILICON ON INSULATOR·Filed 2015·Application pending·0 cites
- 3753US2025004196A1Photonic-electronic integrated-circuit chip and process for fabricating sameSOITEC SILICON ON INSULATOR·Filed 2022·Application pending·0 cites
- 3852US2024395603A1Composite structure comprising a useful monocrystalline sic layer on a polycrystalline sic carrier substrate and method for manufacturing said structureSOITEC SILICON ON INSULATOR·Filed 2022·Application pending·0 cites
- 3952US2025006492A1Method for manufacturing a composite structure comprising a thin film of monocrystalline sic on a carrier substrate of polycrystalline sicSOITEC SILICON ON INSULATOR·Filed 2022·Application pending·0 cites
- 4051US2024392476A1Method for transferring a monocrystalline sic layer onto a polycrystalline sic carrier using a poly crystalline sic intermediate layerSOITEC SILICON ON INSULATOR·Filed 2022·Application pending·0 cites
- 4151US2012067524A1Apparatus for manufacturing semiconductor devicesBROEKAART MARCEL·Filed 2011·Application pending·0 cites
- 4250US2011308721A1Apparatus for manufacturing semiconductor devicesBROEKAART MARCEL·Filed 2010·Application pending·0 cites
- 4350US2016197006A1Method for locating devicesSOITEC SILICON ON INSULATOR·Filed 2014·Application pending·0 cites
- 4448US12198983B2Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiCSOITEC SILICON ON INSULATOR·Filed 2020·Granted Jan 14, 2025·0 cites·20 claims
- 4547US12320031B2Method for manufacturing a composite structure comprising a thin layer made of monocrystalline SiC on a carrier substrate made of SiCSOITEC SILICON ON INSULATOR·Filed 2021·Granted Jun 3, 2025·0 cites·18 claims
- 4647US2016086974A1Method for fabricating semiconductor structures including transistor channels having different strain states, and related semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2015·Application pending·0 cites
- 4746US2012015497A1Preparing a Surface of a Sapphire Substrate for Fabricating HeterostructuresGAUDIN GWELTAZ·Filed 2009·Application pending·0 cites
- 4845US10276492B2Method for fabricating semiconductor structures including a high resistivity layer, and related semiconductor structuresSOITEC SILICON ON INSULATOR·Filed 2017·Granted Apr 30, 2019·0 cites·13 claims
- 4945US8841742B2Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methodsSOITEC SILICON ON INSULATOR·Filed 2013·Granted Sep 23, 2014·0 cites·42 claims
- 5044US9548237B2Method for transferring a layer comprising a compressive stress layer and related structuresSOITEC SILICON ON INSULATOR·Filed 2013·Granted Jan 17, 2017·0 cites·17 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →