Inventor · disambiguated record
Israel Beinglass
Also filed as: BEINGLASS ISRAEL
60 granted patents·3 pending applications·3,205 citations·filing 1976–2025
99Inventor score
Top patents by PatentIndex Score
63 records- 0199US8541819B1Semiconductor device and structureOR-BACH ZVI·Filed 2010·Granted Sep 24, 2013·152 cites·20 claims
- 0299US8237228B2System comprising a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Aug 7, 2012·72 cites·30 claims
- 0399US8058137B1Method for fabrication of a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Nov 15, 2011·129 cites·20 claims
- 0498US9136153B23D semiconductor device and structure with back-biasOR-BACH ZVI·Filed 2012·Granted Sep 15, 2015·53 cites·20 claims
- 0598US8754533B2Monolithic three-dimensional semiconductor device and structureOR-BACH ZVI·Filed 2010·Granted Jun 17, 2014·68 cites·20 claims
- 0698US8395191B2Semiconductor device and structureOR-BACH ZVI·Filed 2010·Granted Mar 12, 2013·51 cites·22 claims
- 0798US8273610B2Method of constructing a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Sep 25, 2012·111 cites·12 claims
- 0898US5645646ASusceptor for deposition apparatusAPPLIED MATERIALS INC·Filed 1996·Granted Jul 8, 1997·406 cites·24 claims
- 0997US9613844B23D semiconductor device having two layers of transistorsMONOLITHIC 3D INC·Filed 2015·Granted Apr 4, 2017·19 cites·6 claims
- 1097US8362482B2Semiconductor device and structureMONOLITHIC 3D INC·Filed 2011·Granted Jan 29, 2013·39 cites·17 claims
- 1197US8294159B2Method for fabrication of a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Oct 23, 2012·35 cites·7 claims
- 1297US8153499B2Method for fabrication of a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Apr 10, 2012·37 cites·29 claims
- 1397US7964916B2Method for fabrication of a semiconductor device and structureMONOLITHIC 3D INC·Filed 2010·Granted Jun 21, 2011·42 cites·8 claims
- 1497US5352636AIn situ method for cleaning silicon surface and forming layer thereon in same chamberAPPLIED MATERIALS INC·Filed 1992·Granted Oct 4, 1994·305 cites·24 claims
- 1596US8148728B2Method for fabrication of a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Apr 3, 2012·22 cites·6 claims
- 1696US7986042B2Method for fabrication of a semiconductor device and structureMONOLITHIC 3D INC·Filed 2010·Granted Jul 26, 2011·25 cites·14 claims
- 1796US7960242B2Method for fabrication of a semiconductor device and structureMONOLITHIC 3D INC·Filed 2010·Granted Jun 14, 2011·24 cites·20 claims
- 1896US5551982ASemiconductor wafer process chamber with susceptor back coatingAPPLIED MATERIALS INC·Filed 1994·Granted Sep 3, 1996·136 cites·22 claims
- 1995US9711407B2Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layerOR-BACH ZVI·Filed 2010·Granted Jul 18, 2017·29 cites·18 claims
- 2095US8378494B2Method for fabrication of a semiconductor device and structureMONOLITHIC 3D INC·Filed 2011·Granted Feb 19, 2013·16 cites·21 claims
- 2195US5932286ADeposition of silicon nitride thin filmsAPPLIED MATERIALS INC·Filed 1993·Granted Aug 3, 1999·136 cites·7 claims
- 2294US9406670B1System comprising a semiconductor device and structureMONOLITHIC 3D INC·Filed 2014·Granted Aug 2, 2016·11 cites·23 claims
- 2394US8709880B2Method for fabrication of a semiconductor device and structureOR-BACH ZVI·Filed 2011·Granted Apr 29, 2014·14 cites·23 claims
- 2494US7427568B2Method of forming an interconnect structureAPPLIED MATERIALS INC·Filed 2006·Granted Sep 23, 2008·20 cites·9 claims
- 2594US5607724ALow temperature high pressure silicon deposition methodAPPLIED MATERIALS INC·Filed 1995·Granted Mar 4, 1997·102 cites·6 claims
- 2693US9564432B23D semiconductor device and structureMONOLITHIC 3D INC·Filed 2014·Granted Feb 7, 2017·11 cites·20 claims
- 2793US8907442B2System comprising a semiconductor device and structureOR-BACH ZVI·Filed 2012·Granted Dec 9, 2014·11 cites·30 claims
- 2892US5876797ALow temperature high pressure silicon deposition methodAPPLIED MATERIALS INC·Filed 1997·Granted Mar 2, 1999·81 cites·6 claims
- 2992US5700520ALow temperature, high pressure silicon deposition methodAPPLIED MATERIALS INC·Filed 1996·Granted Dec 23, 1997·78 cites·8 claims
- 3090US7772121B2Method of forming a trench structureAPPLIED MATERIALS INC·Filed 2006·Granted Aug 10, 2010·12 cites·6 claims
- 3190US5874129ALow temperature, high pressure silicon deposition methodAPPLIED MATERIALS INC·Filed 1996·Granted Feb 23, 1999·87 cites·30 claims
- 3290US5614257ALow temperature, high pressure silicon deposition methodAPPLIED MATERIALS INC·Filed 1995·Granted Mar 25, 1997·94 cites·8 claims
- 3389US10354995B2Semiconductor memory device and structureMONOLITHIC 3D INC·Filed 2018·Granted Jul 16, 2019·6 cites·20 claims
- 3489US8664042B2Method for fabrication of configurable systemsOR-BACH ZVI·Filed 2012·Granted Mar 4, 2014·8 cites·20 claims
- 3589US6197694B1In situ method for cleaning silicon surface and forming layer thereon in same chamberAPPLIED MATERIALS INC·Filed 1996·Granted Mar 6, 2001·86 cites·19 claims
- 3688US5695819AMethod of enhancing step coverage of polysilicon depositsAPPLIED MATERIALS INC·Filed 1996·Granted Dec 9, 1997·79 cites·12 claims
- 3787US8405420B2System comprising a semiconductor device and structureOR-BACH ZVI·Filed 2010·Granted Mar 26, 2013·10 cites·14 claims
- 3884US10497713B23D semiconductor memory device and structureMONOLITHIC 3D INC·Filed 2017·Granted Dec 3, 2019·4 cites·7 claims
- 3984US5599397ASemiconductor wafer process chamber with suspector back coatingAPPLIED MATERIALS INC·Filed 1996·Granted Feb 4, 1997·43 cites·10 claims
- 4083US5576059ADepositing polysilicon films having improved uniformity and apparatus thereforAPPLIED MATERIALS INC·Filed 1995·Granted Nov 19, 1996·39 cites·4 claims
- 4183US4441247AMethod of making MOS device by forming self-aligned polysilicon and tungsten composite gateINTEL CORP·Filed 1981·Granted Apr 10, 1984·63 cites·21 claims
- 4281US9941332B2Semiconductor memory device and structureMONOLITHIC 3D INC·Filed 2017·Granted Apr 10, 2018·3 cites·20 claims
- 4381US9853089B2Semiconductor device and structureMONOLITHIC 3D INC·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
- 4481US6169030B1Metallization process and methodAPPLIED MATERIALS INC·Filed 1998·Granted Jan 2, 2001·57 cites·25 claims
- 4580US7115516B2Method of depositing a material layerAPPLIED MATERIALS INC·Filed 2001·Granted Oct 3, 2006·18 cites·3 claims
- 4679US4975385AMethod of constructing lightly doped drain (LDD) integrated circuit structureAPPLIED MATERIALS INC·Filed 1990·Granted Dec 4, 1990·48 cites·19 claims
- 4777US6954711B2Test substrate reclamation method and apparatusAPPLIED MATERIALS INC·Filed 2003·Granted Oct 11, 2005·20 cites·38 claims
- 4877US6017144AMethod and apparatus for depositing highly oriented and reflective crystalline layers using a low temperature seeding layerAPPLIED MATERIALS INC·Filed 1996·Granted Jan 25, 2000·50 cites·32 claims
- 4976US7401066B2Correlation of end-of-line data mining with process tool data miningAPPLIED MATERIALS INC·Filed 2002·Granted Jul 15, 2008·25 cites·22 claims
- 5076US5940733AMethod of making polysilicon/tungsten silicide multilayer composite on an integrated circuit structureAPPLIED MATERIALS INC·Filed 1997·Granted Aug 17, 1999·38 cites·14 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →