Inventor · disambiguated record
Ishtak Karim
Also filed as: KARIM ISHTAK
30 granted patents·10 pending applications·202 citations·filing 2010–2025
96Inventor score
Top patents by PatentIndex Score
40 records- 0198US10074543B2High dry etch rate materials for semiconductor patterning applicationsLAM RES CORP·Filed 2016·Granted Sep 11, 2018·33 cites·26 claims
- 0298US9738977B1Showerhead curtain gas method and system for film profile modulationLAM RES CORP·Filed 2016·Granted Aug 22, 2017·26 cites·24 claims
- 0397US10679848B2Selective atomic layer deposition with post-dose treatmentLAM RES CORP·Filed 2018·Granted Jun 9, 2020·10 cites·13 claims
- 0497US10037884B2Selective atomic layer deposition for gapfill using sacrificial underlayerLAM RES CORP·Filed 2016·Granted Jul 31, 2018·30 cites·20 claims
- 0596US10655224B2Conical wafer centering and holding device for semiconductor processingLAM RES CORP·Filed 2016·Granted May 19, 2020·8 cites·20 claims
- 0696US10062563B2Selective atomic layer deposition with post-dose treatmentLAM RES CORP·Filed 2016·Granted Aug 28, 2018·16 cites·18 claims
- 0796US9644271B1Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabricationLAM RES CORP·Filed 2016·Granted May 9, 2017·21 cites·24 claims
- 0894US10202691B2Showerhead curtain gas method and system for film profile modulationLAM RES CORP·Filed 2017·Granted Feb 12, 2019·8 cites·32 claims
- 0994US10128160B2Systems and methods for detection of plasma instability by electrical measurementLAM RES CORP·Filed 2017·Granted Nov 13, 2018·6 cites·20 claims
- 1094US9870917B2Variable temperature hardware and methods for reduction of wafer backside depositionLAM RES CORP·Filed 2016·Granted Jan 16, 2018·10 cites·11 claims
- 1192US10094018B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2015·Granted Oct 9, 2018·7 cites·17 claims
- 1289US11970772B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2021·Granted Apr 30, 2024·1 cites·10 claims
- 1387US9824941B2Systems and methods for detection of plasma instability by electrical measurementLAM RES CORP·Filed 2016·Granted Nov 21, 2017·3 cites·21 claims
- 1486US12077859B2Variable cycle and time RF activation method for film thickness matching in a multi-station deposition systemLAM RES CORP·Filed 2022·Granted Sep 3, 2024·1 cites·26 claims
- 1586US9478411B2Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOSLAM RES CORP·Filed 2014·Granted Oct 25, 2016·7 cites·17 claims
- 1685US11180850B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2018·Granted Nov 23, 2021·3 cites·4 claims
- 1783US9997422B2Systems and methods for frequency modulation of radiofrequency power supply for controlling plasma instabilityLAM RES CORP·Filed 2016·Granted Jun 12, 2018·2 cites·20 claims
- 1883US9478438B2Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursorLAM RES CORP·Filed 2014·Granted Oct 25, 2016·5 cites·25 claims
- 1981US12274047B2Line bending control for memory applicationsLAM RES CORP·Filed 2023·Granted Apr 8, 2025·0 cites·21 claims
- 2079US10622243B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2017·Granted Apr 14, 2020·2 cites·19 claims
- 2177US2025234503A1Line bending control for memory applicationsLAM RES CORP·Filed 2025·Application pending·0 cites
- 2276US12448687B2Dynamic precursor dosing for atomic layer depositionLAM RES CORP·Filed 2024·Granted Oct 21, 2025·0 cites·12 claims
- 2376US2025062150A1Electrostatic chuck with seal surfaceLAM RES CORP·Filed 2024·Application pending·0 cites
- 2473US11864372B2Line bending control for memory applicationsLAM RES CORP·Filed 2019·Granted Jan 2, 2024·1 cites·22 claims
- 2572US10340136B1Minimization of carbon loss in ALD SiO2 deposition on hardmask filmsLAM RES CORP·Filed 2018·Granted Jul 2, 2019·1 cites·20 claims
- 2668US11651963B2Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based filmLAM RES CORP·Filed 2021·Granted May 16, 2023·0 cites·12 claims
- 2763US11443975B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2020·Granted Sep 13, 2022·0 cites·24 claims
- 2863US8343318B2Magnetic lensing to improve deposition uniformity in a physical vapor deposition (PVD) processNOVELLUS SYSTEMS INC·Filed 2010·Granted Jan 1, 2013·1 cites·32 claims
- 2959US10978302B2Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based filmLAM RES CORP·Filed 2018·Granted Apr 13, 2021·0 cites·12 claims
- 3059US10692717B2Minimization of carbon loss in ALD SiO2 deposition on hardmask filmsLAM RES CORP·Filed 2019·Granted Jun 23, 2020·0 cites·16 claims
- 3157US2025246434A1Metal silicide contact formationLAM RES CORP·Filed 2023·Application pending·0 cites
- 3256US12142509B2Electrostatic chuck with seal surfaceLAM RES CORP·Filed 2019·Granted Nov 12, 2024·0 cites·33 claims
- 3355US2017314129A1Variable cycle and time rf activation method for film thickness matching in a multi-station deposition systemLAM RES CORP·Filed 2016·Application pending·0 cites
- 3453US9941113B2Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabricationLAM RES CORP·Filed 2017·Granted Apr 10, 2018·0 cites·24 claims
- 3547US2025069948A1Deposition of metals in recessed features with the use of halogen-containing deposition inhibitorsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3640US2015163860A1Apparatus and method for uniform irradiation using secondary irradiant energy from a single light sourceLAM RES CORP·Filed 2013·Application pending·0 cites
- 3740US2014127912A1Plasma process etch-to-deposition ratio modulation via ground surface designWU LIQI·Filed 2012·Application pending·0 cites
- 3839US2012228125A1Creation of magnetic field (vector potential) well for improved plasma deposition and resputtering uniformityWU LIQI·Filed 2012·Application pending·0 cites
- 3938US2012070589A1Creation of magnetic field (vector potential) well for improved plasma deposition and resputtering uniformityWU LIQI·Filed 2011·Application pending·0 cites
- 4036US2013206725A1Creation of off-axis null magnetic field locus for improved uniformity in plasma deposition and etchingLEESER KARL·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ishtak Karim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →