Inventor · disambiguated record
Itaru Kanno
Also filed as: KANNO ITARU
39 granted patents·14 pending applications·738 citations·filing 1990–2023
98Inventor score
Files withTOKYO ELECTRON LTD24MITSUBISHI ELECTRIC CORP13RENESAS TECH CORP5RENESAS ELECTRONICS CORP2EKC TECHNOLOGY K K1
Top patents by PatentIndex Score
53 records- 0196US11367630B2Substrate cleaning method, substrate cleaning system, and memory mediumTOKYO ELECTRON LTD·Filed 2020·Granted Jun 21, 2022·3 cites·20 claims
- 0294US9953826B2Substrate cleaning method, substrate cleaning system, and memory mediumTOKYO ELECTRON LTD·Filed 2014·Granted Apr 24, 2018·15 cites·18 claims
- 0391US10272478B2Substrate processing system, substrate cleaning method, and recording mediumTOKYO ELECTRON LTD·Filed 2015·Granted Apr 30, 2019·7 cites·24 claims
- 0491US5216890ADevice for and method of producing hyperfine frozen particlesMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Jun 8, 1993·65 cites·10 claims
- 0590US5283989AApparatus for polishing an article with frozen particlesMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Feb 8, 1994·89 cites·3 claims
- 0689US10734255B2Substrate cleaning method, substrate cleaning system and memory mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 4, 2020·6 cites·20 claims
- 0788US7250391B2Cleaning composition for removing resists and method of manufacturing semiconductor deviceEKC TECHNOLOGY K K·Filed 2003·Granted Jul 31, 2007·56 cites·9 claims
- 0888US5934566AWashing apparatus and washing methodMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Aug 10, 1999·90 cites·21 claims
- 0986US9378940B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2013·Granted Jun 28, 2016·9 cites·17 claims
- 1086US6048409AWashing apparatus and washing methodMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 11, 2000·73 cites·7 claims
- 1185US5147466AMethod of cleaning a surface by blasting the fine frozen particles against the surfaceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Sep 15, 1992·52 cites·4 claims
- 1284US9799538B2Substrate cleaning systemTOKYO ELECTRON LTD·Filed 2013·Granted Oct 24, 2017·6 cites·12 claims
- 1383US9818598B2Substrate cleaning method and recording mediumTOKYO ELECTRON LTD·Filed 2015·Granted Nov 14, 2017·4 cites·10 claims
- 1482US10811283B2Substrate cleaning method, substrate cleaning system, and memory mediumTOKYO ELECTRON LTD·Filed 2018·Granted Oct 20, 2020·2 cites·18 claims
- 1581US10043652B2Substrate cleaning method, substrate cleaning system, and memory mediumTOKYO ELECTRON LTD·Filed 2014·Granted Aug 7, 2018·5 cites·15 claims
- 1680US10835908B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2018·Granted Nov 17, 2020·2 cites·11 claims
- 1779US5918817ATwo-fluid cleaning jet nozzle and cleaning apparatus, and method utilizing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jul 6, 1999·59 cites·23 claims
- 1877US10998183B2Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory mediumTOKYO ELECTRON LTD·Filed 2016·Granted May 4, 2021·2 cites·20 claims
- 1977US5873380AWafer cleaning apparatusMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Feb 23, 1999·49 cites·10 claims
- 2076US8037891B2Two-fluid nozzle for cleaning substrate and substrate cleaning apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Oct 18, 2011·8 cites·11 claims
- 2174US2022277968A1Substrate cleaning method, substrate cleaning system, and memory mediumTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2273US10792711B2Substrate processing system, substrate cleaning method, and recording mediumTOKYO ELECTRON LTD·Filed 2018·Granted Oct 6, 2020·1 cites·12 claims
- 2372US5074083ACleaning device using fine frozen particlesMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 24, 1991·30 cites·6 claims
- 2469US9443712B2Substrate cleaning method and substrate cleaning systemTOKYO ELECTRON LTD·Filed 2013·Granted Sep 13, 2016·2 cites·13 claims
- 2568US6708903B2Two-fluid cleaning jet nozzle, cleaning equipment and method of fabricating semiconductor device employing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·11 cites·7 claims
- 2661US5746233AWashing apparatus and method thereforMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 5, 1998·26 cites·7 claims
- 2758US6730239B1Cleaning agent for semiconductor device & method of fabricating semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted May 4, 2004·7 cites·8 claims
- 2858US2024047234A1Substrate processing apparatus, supply system, substrate processing method, and supply methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2956US6358329B1Resist residue removal apparatus and methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 19, 2002·20 cites·16 claims
- 3053US9362184B2Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatusRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 7, 2016·0 cites·12 claims
- 3153US2015064911A1Substrate processing method, substrate processing apparatus and storage mediumTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 3253US2015064910A1Substrate processing method, substrate processing system and memory mediumTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 3351US2025054783A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3451US2014041685A1Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory mediumTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 3550US6199567B1Method and apparatus for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 13, 2001·16 cites·8 claims
- 3649US11201050B2Substrate processing method, recording medium and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Dec 14, 2021·0 cites·14 claims
- 3748US6713232B2Method of manufacturing semiconductor device with improved removal of resist residuesKAO CORP·Filed 2000·Granted Mar 30, 2004·2 cites·19 claims
- 3847US2023264233A1Liquid processing apparatus and liquid processing methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 3945US2013189835A1Method for cleaning a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 4045US2009014028A1Method of cleaning substrates and substrate cleanerKURITA WATER IND LTD·Filed 2008·Application pending·0 cites
- 4144US8946895B2Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatusKATO TAKAHIKO·Filed 2009·Granted Feb 3, 2015·0 cites·2 claims
- 4243US2009137118A1Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 4341US10242889B2Substrate liquid processing method and substrate liquid processing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Mar 26, 2019·0 cites·8 claims
- 4441US2010330794A1Method for cleaning a semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 4540US5129198ACleaning device for semiconductor wafersTAIYO SANSO CO LTD·Filed 1991·Granted Jul 14, 1992·11 cites·11 claims
- 4639US10083845B2Substrate processing apparatus, substrate processing method and storage mediumTOKYO ELECTRON LTD·Filed 2016·Granted Sep 25, 2018·0 cites·15 claims
- 4739US7537987B2Semiconductor device manufacturing methodRENESAS TECH CORP·Filed 2006·Granted May 26, 2009·0 cites·3 claims
- 4838US5357718AWafer rinsing apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Oct 25, 1994·6 cites·4 claims
- 4937US2004016447A1Cleaning equipment and cleaning methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 5035US6092537APost-treatment method for dry etchingMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jul 25, 2000·4 cites·15 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →