Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory medium

Abstract

An apparatus for cleaning a substrate includes a cleaning chamber which accommodates a substrate inside the cleaning chamber, a treatment solution supply device which supplies a treatment solution having a volatile component and capable of solidifying or being cured to form a treatment film through vaporization of the volatile component, and a removal solution supply device which supplies a removal solution capable of removing the treatment film formed on a surface of the substrate. The treatment solution supply device supplies the treatment solution on the surface of the substrate set inside the cleaning chamber, and the removal solution supply device supplies the removal solution onto the treatment film formed on the surface of the substrate.

What is claimed is: 
     
         1 . An apparatus for cleaning a substrate, comprising:
 a cleaning chamber configured to accommodate a substrate inside the cleaning chamber;   a treatment solution supply device configured to supply a treatment solution which includes a volatile component and which solidifies or is cured to form a treatment film through vaporization of the volatile component; and   a removal solution supply device configured to supply a removal solution which removes the treatment film formed on a surface of the substrate,   wherein the treatment solution supply device is configured to supply the treatment solution on the surface of the substrate set inside the cleaning chamber, and the removal solution supply device is configured to supply the removal solution onto the treatment film formed on the surface of the substrate.   
     
     
         2 . The apparatus for cleaning a substrate according to  claim 1 , further comprising a substrate holding device configured to hold the substrate, wherein the cleaning chamber is configured to accommodate the treatment solution supply device, the removal solution supply device and the substrate holding device inside the cleaning chamber. 
     
     
         3 . The apparatus for cleaning a substrate according to  claim 2 , wherein the substrate holding device comprises a holding mechanism configured to hold a peripheral portion of the substrate and a removal solution supply element configured to supply the removal solution to the holding mechanism. 
     
     
         4 . The apparatus for cleaning a substrate according to  claim 2 , wherein the substrate holding device comprises a first holder element configured to hold the substrate and a second holder element configured to move independent from the first holder element. 
     
     
         5 . The apparatus for cleaning a substrate according to  claim 1 , further comprising a solvent supply device configured to supply to the substrate a solvent which has affinity to the treatment solution. 
     
     
         6 . The apparatus for cleaning a substrate according to  claim 1 , further comprising a vaporization acceleration device configured to accelerate vaporization of the volatile component of the treatment solution. 
     
     
         7 . The apparatus for cleaning a substrate according to  claim 6 , wherein the vaporization acceleration device is configured to heat the treatment solution such that the vaporization of the volatile component is accelerated. 
     
     
         8 . The apparatus for cleaning a substrate according to  claim 6 , wherein the vaporization acceleration device is configured to reduce a pressure in the cleaning chamber such that the vaporization of the volatile component is accelerated. 
     
     
         9 . A substrate cleaning system, comprising:
 a substrate cleaning apparatus configured to clean a substrate; and   a control apparatus configured to control the substrate cleaning apparatus,   wherein the substrate cleaning apparatus comprises a cleaning chamber configured to accommodate the substrate inside the cleaning chamber, a treatment solution supply device configured to supply a treatment solution which includes a volatile component and which solidifies or is cured to form a treatment film through vaporization of the volatile component, and a removal solution supply device configured to supply a removal solution which removes the treatment film formed on a surface of the substrate, the treatment solution supply device is configured to supply the treatment solution on the surface of the substrate set inside the cleaning chamber, the removal solution supply device is configured to supply the removal solution onto the treatment film formed on the surface of the substrate, and the control apparatus is configured to control the treatment solution supply device such that the treatment solution supply device supplies a sufficient amount of the treatment solution to clean the surface of the substrate set inside the cleaning chamber and the removal solution supply device such that the removal solution supply device supplies a sufficient amount of the removal solution to remove the treatment film from the substrate after the treatment film is formed by solidifying or curing the treatment solution on the surface of the substrate.   
     
     
         10 . A method for cleaning a substrate, comprising:
 setting a substrate inside a cleaning chamber;   supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film;   vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate; and   supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.   
     
     
         11 . The method for cleaning a substrate according to  claim 10 , wherein the supplying of the treatment solution and the supplying of the removal solution are conducted in the cleaning chamber, and the substrate is not transferred between the supplying of the treatment solution and the supplying of the removal solution. 
     
     
         12 . The method for cleaning a substrate according to  claim 10 , further comprising accelerating vaporization of the volatile component of the treatment solution supplied on the surface of substrate. 
     
     
         13 . The method for cleaning a substrate according to  claim 10 , further comprising supplying a solvent which has affinity to the treatment solution. 
     
     
         14 . The method for cleaning a substrate according to  claim 10 , wherein the treatment solution includes a synthetic resin. 
     
     
         15 . The method for cleaning a substrate according to  claim 10 , wherein the treatment solution further includes a chemical solution which dissolves foreign matter attached on the substrate or material deposited on the substrate. 
     
     
         16 . The method for cleaning a substrate according to  claim 14 , wherein the synthetic resin is an acrylic resin or a phenolic resin. 
     
     
         17 . The method for cleaning a substrate according to  claim 14 , wherein the synthetic resin is at least one resin selected from the group consisting of epoxy resin, melanin resin, urea resin, unsaturated polyester resin, alkyd resin, polyurethane, polyimide, polyethylene, polypropylene, polyvinylidene chloride, polystyrene, polyvinyl acetate, polytetrafluoroethylene, acrylonitrile butadiene styrene resin, styrene acrylonitrile resin, polyamide, nylon, polyacetal, polycarbonate, denatured polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polyphenylene sulfide, polysulfone, polyether ether ketone, and polyamideimide. 
     
     
         18 . The method for cleaning a substrate according to  claim 10 , wherein the removal solution is an alkaline solution. 
     
     
         19 . The method for cleaning a substrate according to  claim 10 , wherein the removal solution includes at least one solution selected from the group consisting of ammonium, tetramethyl ammonium hydroxide and choline. 
     
     
         20 . A non-transitory computer-readable medium including a program, which when executed by the control apparatus of the substrate cleaning system according to  claim 9 , causes the control apparatus to:
 instruct the treatment solution supply device to supply on the surface of the substrate the treatment solution;   instruct the substrate cleaning apparatus to vaporize the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment film is formed on the surface of the substrate; and   instruct the removal solution supply device to supply the removal solution onto the treatment film formed on the surface of the substrate.