Inventor · disambiguated record
Ivan Nikitin
Also filed as: NIKITIN IVAN
65 granted patents·13 pending applications·224 citations·filing 2008–2025
98Inventor score
Files withINFINEON TECHNOLOGIES AG39INFINEON TECHNOLOGIES AUSTRIA AG13NIKITIN IVAN11GUTH KARSTEN2INFINEON TECHNOLOGIES AUSTRIA2
Top patents by PatentIndex Score
78 records- 0197US9530752B2Method for forming electronic componentsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 27, 2016·37 cites·26 claims
- 0295US8884420B1Multichip deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 11, 2014·18 cites·20 claims
- 0394US7767495B2Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric materialINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 3, 2010·31 cites·21 claims
- 0493US10211133B2Package with interconnections having different melting temperaturesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 19, 2019·8 cites·3 claims
- 0593US8120158B2Laminate electronic deviceEWE HENRIK·Filed 2009·Granted Feb 21, 2012·28 cites·15 claims
- 0692US11901273B2Power module with press-fit contactsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 13, 2024·3 cites·18 claims
- 0789US8513062B2Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor deviceNIKITIN IVAN·Filed 2010·Granted Aug 20, 2013·9 cites·21 claims
- 0888US12002724B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Jun 4, 2024·1 cites·7 claims
- 0987US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
- 1085US9006873B2Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 14, 2015·6 cites·9 claims
- 1182US11075185B2Semiconductor package with multi-level conductive clip for top side coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 27, 2021·4 cites·16 claims
- 1282US9040346B2Semiconductor package and methods of formation thereofNIKITIN IVAN·Filed 2012·Granted May 26, 2015·6 cites·20 claims
- 1382US9018742B2Electronic device and a method for fabricating an electronic deviceNIKITIN IVAN·Filed 2012·Granted Apr 28, 2015·6 cites·29 claims
- 1481US8698298B2Laminate electronic deviceHENRIK EWE·Filed 2012·Granted Apr 15, 2014·9 cites·5 claims
- 1581US8362617B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 29, 2013·9 cites·15 claims
- 1679US11404336B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 2, 2022·1 cites·11 claims
- 1779US8928140B2Method of manufacturing an electronic systemNIKITIN IVAN·Filed 2012·Granted Jan 6, 2015·4 cites·11 claims
- 1878US9420731B2Electronic power device and method of fabricating an electronic power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Aug 16, 2016·4 cites·12 claims
- 1976US2025062290A1Power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2075US7682875B2Method for fabricating a module including a sintered jointINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 23, 2010·6 cites·19 claims
- 2173US7994646B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 9, 2011·5 cites·16 claims
- 2272US12211824B2Power semiconductor package having first and second lead framesINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·15 claims
- 2370US9532459B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 27, 2016·2 cites·12 claims
- 2470US8749075B2Integrated circuits and a method for manufacturing an integrated circuitMAHLER JOACHIM·Filed 2012·Granted Jun 10, 2014·3 cites·20 claims
- 2569US9496228B2Integrated circuit and method of manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2016·Granted Nov 15, 2016·1 cites·29 claims
- 2669US8872315B2Electronic device and method of fabricating an electronic deviceHOSSEINI KHALIL·Filed 2012·Granted Oct 28, 2014·2 cites·15 claims
- 2769US8101517B2Semiconductor device and method for making sameFRANK MANFRED·Filed 2009·Granted Jan 24, 2012·4 cites·36 claims
- 2868US11862533B2Fluid-cooled package having shielding layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 2967US11574889B2Power module comprising two substrates and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 7, 2023·2 cites·12 claims
- 3067US8980687B2Semiconductor device and method of manufacturing thereofNIKITIN IVAN·Filed 2012·Granted Mar 17, 2015·2 cites·25 claims
- 3167US2023361087A1Molded power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3266US10461017B2Package with partially encapsulated cooling channel for cooling an encapsulated chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·1 cites·15 claims
- 3366US2025233092A1Electronic device having a solder stop featureINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 3464US12300643B2Solder stop feature for electronic devicesINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·8 claims
- 3563US10453771B2Package with roughened encapsulated surface for promoting adhesionINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 22, 2019·1 cites·9 claims
- 3663US8828804B2Semiconductor device and methodNIKITIN IVAN·Filed 2008·Granted Sep 9, 2014·2 cites·7 claims
- 3763US8304884B2Semiconductor device including spacer elementNIKITIN IVAN·Filed 2009·Granted Nov 6, 2012·2 cites·23 claims
- 3862US8415207B2Module including a sintered joint bonding a semiconductor chip to a copper surfaceGUTH KARSTEN·Filed 2012·Granted Apr 9, 2013·1 cites·19 claims
- 3962US8253233B2Module including a sintered joint bonding a semiconductor chip to a copper surfaceGUTH KARSTEN·Filed 2008·Granted Aug 28, 2012·2 cites·24 claims
- 4062US2025293194A1Molded Electronic Component Having a Metallic Loops Embedded in a Mold CompoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 4160US7754533B2Method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 13, 2010·1 cites·27 claims
- 4259US12494418B2Power module with press-fit contactsINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 9, 2025·0 cites·15 claims
- 4359US2024170377A1Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device ModuleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 4458US11688713B2Additive manufacturing of a frontside or backside interconnect of a semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jun 27, 2023·0 cites·13 claims
- 4557US12438068B2Stacked module arrangementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 4657US11450593B2Spacer frame for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Sep 20, 2022·0 cites·17 claims
- 4757US2023352378A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 4856US12506051B2Semiconductor package comprising a cavity with exposed contacts and a semiconductor moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 23, 2025·0 cites·16 claims
- 4956US2023360929A1Method for fabricating a semiconductor device module with increased reliability and a semiconductor device moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 5055US12283563B2Semiconductor module with bond wire loop exposed from a molded body and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Apr 22, 2025·0 cites·14 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →