Inventor · disambiguated record
Jack Chang Chien
Also filed as: CHIEN JACK C · CHIEN JACK CHANG
13 granted patents·5 pending applications·24 citations·filing 2005–2012
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0173US8499813B2System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2012·Granted Aug 6, 2013·6 cites·20 claims
- 0269US7763980B2Semiconductor die having a distribution layerSANDISK CORP·Filed 2007·Granted Jul 27, 2010·3 cites·10 claims
- 0369US7611927B2Method of minimizing kerf width on a semiconductor substrate panelSANDISK CORP·Filed 2007·Granted Nov 3, 2009·4 cites·27 claims
- 0468US7967184B2Padless substrate for surface mounted componentsSANDISK CORP·Filed 2005·Granted Jun 28, 2011·4 cites·6 claims
- 0565US7615861B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsSANDISK CORP·Filed 2006·Granted Nov 10, 2009·2 cites·9 claims
- 0662US7952179B2Semiconductor package having through holes for molding back side of packageSANDISK CORP·Filed 2007·Granted May 31, 2011·2 cites·16 claims
- 0761US7772047B2Method of fabricating a semiconductor die having a redistribution layerSANDISK CORP·Filed 2007·Granted Aug 10, 2010·2 cites·34 claims
- 0858US7939382B2Method of fabricating a semiconductor package having through holes for molding back side of packageSANDISK CORP·Filed 2007·Granted May 10, 2011·1 cites·30 claims
- 0951US8482139B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsCHANG CHE-JUNG·Filed 2009·Granted Jul 9, 2013·0 cites·12 claims
- 1051US8232145B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsCHANG CHE-JUNG·Filed 2009·Granted Jul 31, 2012·0 cites·16 claims
- 1150US7939944B2Semiconductor die having a redistribution layerSANDISK CORP·Filed 2010·Granted May 10, 2011·0 cites·20 claims
- 1248US2007262434A1Interconnected ic packages with vertical smt padsSANDISK CORP·Filed 2007·Application pending·0 cites
- 1344US8637972B2Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panelLIAO CHIH-CHIN·Filed 2007·Granted Jan 28, 2014·0 cites·30 claims
- 1444US8212360B2Semiconductor die having a redistribution layerLIAO CHIEN-KO·Filed 2011·Granted Jul 3, 2012·0 cites·15 claims
- 1544US2007158799A1Interconnected IC packages with vertical SMT padsCHIU CHIN-TIEN·Filed 2005·Application pending·0 cites
- 1642US2009085231A1Method of reducing memory card edge roughness by particle blastingCHIU CHIN-TIEN·Filed 2007·Application pending·0 cites
- 1738US2007096285A1Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor dieCHIU CHIN-TIEN·Filed 2005·Application pending·0 cites
- 1833US2011084377A1System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →