Inventor · disambiguated record
Jae-Shin Cho
Also filed as: CHO JAE-SHIN
2 granted patents·1 pending application·15 citations·filing 2009–2012
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0191US8735276B2Semiconductor packages and methods of manufacturing the sameCHUNG HYUN-SOO·Filed 2012·Granted May 27, 2014·14 cites·20 claims
- 0255US7969024B2Semiconductor package with joint reliability, entangled wires including insulating materialSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 28, 2011·1 cites·19 claims
- 0351US2009184411A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jae-Shin Cho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →