Inventor · disambiguated record
Jason E. Cummings
Also filed as: CHATTY KIRAN V · CUMMINGS JASON E
10 granted patents·1 pending application·37 citations·filing 2009–2013
86Inventor score
Top patents by PatentIndex Score
11 records- 0191US8513127B2Chemical mechanical planarization processes for fabrication of FinFET devicesCHANG JOSEPHINE B·Filed 2011·Granted Aug 20, 2013·10 cites·20 claims
- 0289US8524606B2Chemical mechanical planarization with overburden maskCHARNS LESLIE·Filed 2011·Granted Sep 3, 2013·11 cites·25 claims
- 0381US8790991B2Method and structure for shallow trench isolation to mitigate active shortsCUMMINGS JASON E·Filed 2011·Granted Jul 29, 2014·6 cites·10 claims
- 0479US8110483B2Forming an extremely thin semiconductor-on-insulator (ETSOI) layerABADEER WAGDI W·Filed 2009·Granted Feb 7, 2012·7 cites·8 claims
- 0572US8497210B2Shallow trench isolation chemical mechanical planarizationCHARNS LESLIE·Filed 2011·Granted Jul 30, 2013·2 cites·25 claims
- 0657US8232179B2Method to improve wet etch budget in FEOL integrationCUMMINGS JASON E·Filed 2009·Granted Jul 31, 2012·1 cites·14 claims
- 0755US9263517B2Extremely thin semiconductor-on-insulator (ETSOI) layerGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 16, 2016·0 cites·12 claims
- 0852US8507383B2Fabrication of replacement metal gate devicesANDO TAKASHI·Filed 2011·Granted Aug 13, 2013·0 cites·24 claims
- 0949US9018024B2Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thicknessBERLINER NATHANIEL C·Filed 2009·Granted Apr 28, 2015·0 cites·12 claims
- 1048US2012098087A1Forming an extremely thin semiconductor-on-insulator (etsoi) layerABADEER WAGDI W·Filed 2012·Application pending·0 cites
- 1146US8679941B2Method to improve wet etch budget in FEOL integrationCUMMINGS JASON E·Filed 2012·Granted Mar 25, 2014·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →